SCHEMBL645481

SCHEMBL645481

CO[Si](C)(C)[Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL646200 0.77
SCHEMBL479251 0.77
SCHEMBL4199698 0.73
SCHEMBL996457 0.70
SCHEMBL1271765 0.67
SCHEMBL247770 0.67
Ethane SCHEMBL28197216 0.67
SCHEMBL645886 0.67
SCHEMBL17973726 0.64
SCHEMBL28161849 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 236 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0298469-B1 PROCESS OF MAKING HIGHLY POROUS GLASS-CERAMIC BODIES WACKER-CHEMIE GMBH (DE) 1992-09-16 EP claimed
US-5130400-A Reaction of alkoxysilane and water WACKER-CHEMIE GMBH (DE) 1992-07-14 US claimed
EP-0298469-A2 Process of making highly porous glass-ceramic bodies WACKER-CHEMIE GMBH (DE) 1989-01-11 EP claimed
JP-4270730-A None JP disclosed
US-12346026-B2 Composition for forming underlayer film, resist pattern forming method, and manufacturing method of electronic device FUJIFILM CORPORATION (JP) 2025-07-01 US disclosed
WO-2024053557-A1 NON-AQUEOUS ELECTROLYTIC SOLUTION AND BATTERY 株式会社日本触媒 2024-03-14 WO disclosed
US-20220252985-A1 COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-08-11 US disclosed
WO-2021106537-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2021-06-03 WO disclosed
EP-1520891-B1 FILM FORMING COMPOSITION, PROCESS FOR PRODUCING FILM FORMING COMPOSITION, INSULATING FILM FORMING MATERIAL, PROCESS FOR FORMING FILM, AND SILICA-BASED FILM JSR CORP (JP) 2019-05-01 EP disclosed
US-10234762-B2 Pattern-forming method JSR CORPORATION (JP) 2019-03-19 US disclosed
US-10025188-B2 Resist pattern-forming method JSR CORPORATION (JP) 2018-07-17 US disclosed
US-4889904-A HEATING MIXTURE OF ALKOXY-FUNCTIONAL DISILANE AND EITHER ALKOXY-FUNCTIONAL SILANE WITH UNSATURATED SUBSTITUENT OR UNSATURATED HYDROCARBON DOW CORNING CORPORATION (US) 1989-12-26 US disclosed
US-4879142-A Process for preparing a silicon carbide protective coating WACKER-CHEMIE GMBH (DE) 1989-11-07 US disclosed
EP-0336404-A2 Process for preparing of organopolysilanes WACKER-CHEMIE GMBH (DE) 1989-10-11 EP disclosed
US-4824651-A Process for preparing silicon carbide fibers WACKER-CHEMIE GMBH (DE) 1989-04-25 US disclosed
EP-0303908-A2 Thermosetting organopolyiloxane composition WACKER-CHEMIE GMBH (DE) 1989-02-22 EP disclosed
EP-0298469-A2 Process of making highly porous glass-ceramic bodies WACKER-CHEMIE GMBH (DE) 1989-01-11 EP disclosed
EP-0281964-A1 Process for the production of silicon carbide fibres Wacker-Chemie GmbH (DE) 1988-09-14 EP disclosed
EP-0281154-A2 Process for producing a siliconcarbide protective coating WACKER-CHEMIE GMBH (DE) 1988-09-07 EP disclosed
EP-0214664-A2 Process for the preparation of organopolysilanes and use of the organopolysilanes thus obtained WACKER-CHEMIE GMBH (DE) 1987-03-18 EP disclosed