SCHEMBL646510

SCHEMBL646510

C=CCOP(=O)(CC=C)CCCCC

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.39
LPAR3 Q9UBY5 5/20 0.35
LPAR2 Q9HBW0 2/20 0.35
FAAH O00519 1/20 0.35
TRPM8 Q7Z2W7 6/20 0.34
LPAR1 Q92633 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15466463 0.87 TSHR (0.31) TSHR
SCHEMBL5616605 0.79 TSHR (0.42) TSHRLPAR3LPAR2FAAHTRPM8
SCHEMBL4946230 0.79 TSHR (0.31) TSHR
SCHEMBL779023 0.78 LPAR2 (0.30) LPAR3LPAR2
SCHEMBL17507912 0.78 CA2 (0.34) TSHRFAAH
SCHEMBL646400 0.76 CETP (0.49) TSHRLPAR3LPAR2LPAR1
SCHEMBL28985843 0.75 CETP (0.51) TSHRLPAR3LPAR2FAAHLPAR1
SCHEMBL5494226 0.73 CYP3A4 (0.52) TSHRLPAR3LPAR2LPAR1
SCHEMBL4661661 0.72 TRPM8 (0.48) TSHRLPAR3LPAR2FAAHTRPM8
SCHEMBL646902 0.72 TRPM8 (0.48) TSHRLPAR3LPAR2FAAHTRPM8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11066544-B2 Optical resin composition and molded article KANEKA CORPORATION (JP) 2021-07-20 US disclosed
US-10391694-B2 Method of producing film KANEKA CORPORATION (JP) 2019-08-27 US disclosed
US-20180312682-A1 Optical Material ASAHI KASEI KABUSHIKI KAISHA (JP) 2018-11-01 US disclosed
US-10030134-B2 Acrylic thermoplastic resin composition and molded article thereof ASAHI KASEI KABUSHIKI KAISHA (JP) 2018-07-24 US disclosed
US-20170037236-A1 Acrylic Thermoplastic Resin Composition and Molded Article Thereof ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-02-09 US disclosed
US-20160325477-A1 METHOD OF PRODUCING FILM KANEKA CORPORATION (JP) 2016-11-10 US disclosed
EP-2727961-B1 ACRYLIC THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF ASAHI KASEI CHEMICALS CORP (JP) 2016-08-24 EP disclosed
US-8822614-B2 Acrylic thermoplastic resin and molded object thereof ASAHI KASEI CHEMICALS CORPORATION (JP) 2014-09-02 US disclosed
US-8779076-B2 Thermoplastic acrylic resin and molded body for optical member ASAHI KASEI CHEMICALS CORPORATION (JP) 2014-07-15 US disclosed
US-20140128547-A1 Acrylic Thermoplastic Resin Composition and Molded Article Thereof ASAHI KASEI CHEMICALS CORPORATION (JP) 2014-05-08 US disclosed
EP-1911777-A1 LOW BIREFRINGENT COPOLYMER Nippon Shokubai Co., Ltd. (JP) 2008-04-16 EP disclosed
US-20070208119-A1 Thermoplastic resin composition and production process thereof NIPPON SHOKUBAI CO., LTD. (JP) 2007-09-06 US disclosed
US-6794460-B2 JOINT LACTONIZATION AND DEVOLATILIZATION OF A POLYMER CONTAINING ESTER AND HYDROXY GROUPS, ESPECIALLY A COPOLYMER OF ETHYL 2-METHYLOLACRYLATE AND METHYL METHACRYLATE; MOLDING MATERIALS NIPPON SHOKUBAI CO., LTD. (JP) 2004-09-21 US disclosed
US-20030134988-A1 Production process and use for transparent heat-resistant resin NIPPON SHOKUBAI CO., LTD. 2003-07-17 US disclosed
US-20030004278-A1 PRODUCTION PROCESS AND USE FOR TRANSPARENT HEAT-RESISTANT RESIN NIPPON SHOKUBAI CO., LTD. (JP) 2003-01-02 US disclosed
US-6417306-B1 ADDITION COPOLYMERIZATION OF MALEIMIDE AND METHACRYLIC ESTER; CHAIN TRANSFER WITH SULFUR COMPOUND; DISCOLORATION INHIBITION NIPPON SHOKUBAI CO., LTD, (JP) 2002-07-09 US disclosed
EP-1108731-A2 Transparent heat-resistant resin and production process therefor Nippon Shokubai Co., Ltd. (JP) 2001-06-20 EP disclosed
EP-1008606-A1 Production process and use for transparent heat-resistant resin Nippon Shokubai Co., Ltd. (JP) 2000-06-14 EP disclosed
EP-0503744-A2 Curable resin compositions and semiconductor devices coated and sealed with the same HITACHI, LTD. (JP) 1992-09-16 EP disclosed
EP-0237255-A2 Curable resin compositions and semiconductor devices coated and sealed with the same HITACHI, LTD. (JP) 1987-09-16 EP disclosed