SCHEMBL646849

SCHEMBL646849

CC(C)COCc1cccc(COCC(C)C)c1

nearest known ligand 0.42

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TACR1 P25103 8/20 0.41
TSHR P16473 1/20 0.41
CA1 P00915 4/20 0.40
CA2 P00918 2/20 0.40
CA7 P43166 2/20 0.40
CA9 Q16790 2/20 0.40
IDO1 P14902 2/20 0.39
KMT2A Q03164 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18893507 0.92 TACR1 (0.41) TACR1CA1CA2CA7CA9
SCHEMBL11929199 0.88 IDO1 (0.56) TACR1IDO1
SCHEMBL13676864 0.87 IDO1 (0.55) IDO1
SCHEMBL10121249 0.87 TACR1 (0.43) TACR1
SCHEMBL2234953 0.84 TSHR (0.61) TACR1TSHRCA1CA2CA7
SCHEMBL2608861 0.84 ALDH1A1 (0.43) TACR1TSHRKMT2A
SCHEMBL18782929 0.83 LPL (0.48)
Ammonia Solution, Strong SCHEMBL21518144 0.83 TSHR (0.58) TACR1TSHRCA1CA2CA7
Bromide SCHEMBL27301391 0.83 TSHR (0.58) TACR1TSHRCA1CA2CA7
SCHEMBL13676861 0.82 IDO1 (0.58) TACR1IDO1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220216114-A1 METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2022-07-07 US disclosed
US-20140332984-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO LTD (JP) 2014-11-13 US disclosed
US-8200059-B2 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-06-12 US disclosed
US-20120080808-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI (JP) 2012-04-05 US disclosed
US-8119737-B2 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-21 US disclosed
US-20110187006-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2011-08-04 US disclosed
US-7947779-B2 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-05-24 US disclosed
US-20110021005-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2011-01-27 US disclosed
US-20100129045-A1 Adhesive Composition for Optical Waveguide, Adhesive Film for Optical Waveguide and Adhesive Sheet for Optical Waveguide Each Using the Same, and Optical Device Using Any of Them HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-05-27 US disclosed
EP-2128213-A1 ADHESIVE COMPOSITION FOR OPTICAL WAVEGUIDE, ADHESIVE FILM FOR OPTICAL WAVEGUIDE AND ADHESIVE SHEET FOR OPTICAL WAVEGUIDE EACH USING THE SAME, AND OPTICAL DEVICE USING ANY OF THEM Hitachi Chemical Company, Ltd. (JP) 2009-12-02 EP disclosed
US-20090186955-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2009-07-23 US disclosed
US-7517724-B2 Dicing/die bonding sheet HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-04-14 US disclosed
US-20070036971-A1 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device INADA TEIICHI 2007-02-15 US disclosed
US-20070026572-A1 Dicing/die bonding sheet RESONAC CORPORATION (JP) 2007-02-01 US disclosed
US-20060106166-A1 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device INADA TEIICHI 2006-05-18 US disclosed
US-20060100315-A1 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device INADA TEIICHI 2006-05-11 US disclosed
US-20030069331-A1 An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin HITACHI CHEMICAL CO., LTD. (JP) 2003-04-10 US disclosed
EP-0233450-B1 LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-03-11 EP disclosed
US-4783521-A Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-08 US disclosed
EP-0233450-A2 Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-08-26 EP disclosed