Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IDO1 | P14902 | 14/20 | 0.42 |
| ▸ | AGXT | P21549 | 9/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.38 |
| ▸ | BCHE | P06276 | 1/20 | 0.37 |
| ▸ | ACHE | P22303 | 1/20 | 0.37 |
| ▸ | PRMT5 | O14744 | 1/20 | 0.36 |
| ▸ | WDR77 | Q9BQA1 | 1/20 | 0.36 |
| ▸ | MRGPRX4 | Q96LA9 | 2/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19354065 | 0.90 | IDO1 (0.36) | IDO1AGXTCYP3A4BCHEACHE | |
| SCHEMBL22173456 | 0.90 | IDO1 (0.36) | IDO1AGXTCYP3A4BCHEACHE | |
| SCHEMBL14115730 | 0.90 | MRGPRX4 (0.49) | IDO1CYP3A4MRGPRX4 | |
| SCHEMBL19889112 | 0.90 | TRPA1 (0.38) | IDO1AGXTCYP3A4BCHEACHE | |
| SCHEMBL19240343 | 0.87 | ENPP2 (0.50) | CYP3A4 | |
| SCHEMBL10035696 | 0.87 | IDO1 (0.60) | IDO1ACHE | |
| SCHEMBL8338395 | 0.87 | MRGPRX4 (0.48) | CYP3A4MRGPRX4 | |
| SCHEMBL10294060 | 0.86 | CYP3A4 (0.58) | IDO1AGXTCYP3A4 | |
| SCHEMBL10294062 | 0.86 | IDO1 (0.58) | IDO1AGXT | |
| SCHEMBL13046918 | 0.86 | MAOB (0.47) | IDO1AGXTCYP3A4ACHEMRGPRX4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| CN-110945634-B | Heat-dissipating die bonding film and dicing die bonding film | 株式会社力森诺科 | 2023-08-29 | — | — | CN | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| CN-112292431-B | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| CN-114641849-A | Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114641848-A | Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-113348533-B | Method for evaluating pickup property, die-cut/die-bond integrated film, method for evaluating the same, method for sorting the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| US-7517724-B2 | Dicing/die bonding sheet | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20080044667-A1 | Modified Phenolic Resin, Epoxy Resin Composition Containing the Same, and Prepreg Containing the Composition | MITSUI CHEMICALS, INC. (JP) | 2008-02-21 | — | — | US | disclosed |
| US-20070036971-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2007-02-15 | — | — | US | disclosed |
| US-20070026572-A1 | Dicing/die bonding sheet | RESONAC CORPORATION (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060106166-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-18 | — | — | US | disclosed |
| US-20060100315-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-11 | — | — | US | disclosed |
| US-20030069331-A1 | An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-10 | — | — | US | disclosed |
| US-6297332-B1 | FOR SEALING A SEMICONDUCTOR INTEGRATED CIRCUIT, AMINOPHOSPHINE OXIDE AS IMPROVED ACCELERATING AGENT, PACKAGE BETTER IN CRACK RESISTANCE | MITSUI CHEMICALS, INC. (JP) | 2001-10-02 | — | — | US | disclosed |
| US-6201156-B1 | REACTING AN ETHER WITH NITROGEN MONOXIDE IN THE PRESENCE OF A CATALYST BEING COMPOSED OF AN IMIDE COMPOUND | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| EP-0953588-A2 | An epoxy-resin composition and use thereof | Mitsui Chemicals, Inc. (JP) | 1999-11-03 | — | — | EP | disclosed |