SCHEMBL646907

SCHEMBL646907

CC(C)OCc1cccc(COC(C)C)c1

nearest known ligand 0.42

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 10/20 0.42
AGXT P21549 7/20 0.39
FFAR4 Q5NUL3 1/20 0.39
TAAR1 Q96RJ0 4/20 0.38
SLC2A1 P11166 1/20 0.38
SLC6A2 P23975 2/20 0.38
MAOA P21397 1/20 0.38
SLC6A4 P31645 1/20 0.38
SLC6A3 Q01959 1/20 0.38
SIGMAR1 Q99720 1/20 0.38
CYP2A6 P11509 1/20 0.38
ADORA2A P29274 1/20 0.38
ADORA1 P30542 1/20 0.38
CYP3A4 P08684 1/20 0.38
PNMT P11086 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10226540 0.92 TP53 (0.39) IDO1AGXTFFAR4TAAR1SLC2A1
SCHEMBL19354499 0.90 SLC2A1 (0.37) IDO1AGXTFFAR4TAAR1SLC2A1
SCHEMBL17214612 0.90 ENPP2 (0.48) IDO1CYP3A4PNMT
SCHEMBL17919216 0.90 ALDH1A1 (0.38) IDO1AGXTFFAR4TAAR1SLC2A1
SCHEMBL12936622 0.90 MRGPRX4 (0.45) IDO1FFAR4CYP3A4
SCHEMBL8750484 0.87 IDO1 (0.60) IDO1TAAR1MAOA
SCHEMBL10819591 0.87 ENPP2 (0.50) TAAR1CYP3A4
SCHEMBL13412791 0.86 IDO1 (0.58) IDO1AGXTTAAR1MAOACYP3A4
SCHEMBL10314841 0.86 CYP3A4 (0.58) IDO1AGXTTAAR1MAOACYP3A4
SCHEMBL10314838 0.86 IDO1 (0.58) IDO1AGXTTAAR1MAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022255321-A1 INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
WO-2022255322-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
US-20220216114-A1 METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2022-07-07 US disclosed
US-20140332984-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO LTD (JP) 2014-11-13 US disclosed
US-8200059-B2 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-06-12 US disclosed
US-20120080808-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI (JP) 2012-04-05 US disclosed
US-8119737-B2 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-21 US disclosed
US-8053378-B2 Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition MITSUI CHEMICALS, INC. (JP) 2011-11-08 US disclosed
US-20110187006-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2011-08-04 US disclosed
US-7947779-B2 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-05-24 US disclosed
US-5145949-A Production process for making aromatic amine resins MITSUI TOATSU CHEMICALS, INC. (JP) 1992-09-08 US disclosed
US-5106953-A Reacting aromatic amines with bishalogenomethyl derivatives; curing agents or raw materials for polyamides MITSUI TOATSU CHEMICALS, INC. (JP) 1992-04-21 US disclosed
EP-0233450-B1 LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-03-11 EP disclosed
US-5051494-A A bismaleimide and an amino resin MITSUI TOATSU CHEMICALS, INC. (JP) 1991-09-24 US disclosed
US-4959443-A HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE MITSUI TOATSU CHEMICALS, INC. (JP) 1990-09-25 US disclosed
US-4937318-A Aromatic amine resins MITSUI TOATSU CHEMICALS, INC. (JP) 1990-06-26 US disclosed
EP-0342943-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0311387-A2 Aromatic amine resins, their production process and thermosetting resin compositions making use of the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-04-12 EP disclosed
US-4783521-A Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-08 US disclosed
EP-0233450-A2 Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-08-26 EP disclosed