Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PIN1 | Q13526 | 1/20 | 0.59 |
| ▸ | NPY5R | Q15761 | 2/20 | 0.54 |
| ▸ | HPGDS | O60760 | 1/20 | 0.54 |
| ▸ | MAPT | P10636 | 2/20 | 0.52 |
| ▸ | GAA | P10253 | 2/20 | 0.52 |
| ▸ | POLB | P06746 | 2/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.48 |
| ▸ | NPC1 | O15118 | 1/20 | 0.48 |
| ▸ | RAB9A | P51151 | 1/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.47 |
| ▸ | SMPD3 | Q9NY59 | 1/20 | 0.47 |
| ▸ | TNKS | O95271 | 2/20 | 0.45 |
| ▸ | PARP1 | P09874 | 2/20 | 0.45 |
| ▸ | TNKS2 | Q9H2K2 | 2/20 | 0.45 |
| ▸ | RPS6KA3 | P51812 | 1/20 | 0.45 |
| ▸ | SLC9A1 | P19634 | 1/20 | 0.44 |
| ▸ | USP2 | O75604 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28462866 | 0.83 | SMPD3 (0.47) | PIN1NPY5RMAPTNPC1RAB9A | |
| SCHEMBL724250 | 0.81 | NPY5R (0.72) | PIN1NPY5RHPGDSMAPTGAA | |
| SCHEMBL10053583 | 0.81 | MGAM (0.50) | NPY5RMAPTGAANPC1RAB9A | |
| SCHEMBL5274960 | 0.81 | SMPD3 (0.46) | PIN1NPY5RMAPTNPC1RAB9A | |
| SCHEMBL11516210 | 0.81 | MAPK13 (0.53) | PIN1MAPTGAAPOLBL3MBTL1 | |
| SCHEMBL28460536 | 0.80 | PIN1 (0.62) | PIN1NPY5RMAPTNPC1RAB9A | |
| SCHEMBL23758268 | 0.79 | MAPK1 (0.54) | NPY5RMAPTGAANPC1RAB9A | |
| SCHEMBL8075160 | 0.79 | KDM4E (0.49) | PIN1NPY5RHPGDSMAPTGAA | |
| SCHEMBL547135 | 0.79 | PIN1 (0.56) | PIN1MAPTGAAPOLBL3MBTL1 | |
| SCHEMBL482405 | 0.79 | TNKS (0.46) | PIN1NPY5RMAPTNPC1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 164 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113493654-B | Photo-thermal dual-curing adhesive and preparation method thereof | 烟台德邦科技股份有限公司 | 2022-10-21 | — | — | CN | claimed |
| CN-115011293-A | Low-dielectric layer-adding adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2022-09-06 | — | — | CN | claimed |
| CN-114685935-A | Low-dielectric-constant resin composition and preparation method and application thereof | 衡所华威电子有限公司 | 2022-07-01 | — | — | CN | claimed |
| CN-109957286-B | Printing ink and preparation method and application thereof | 深圳市百柔新材料技术有限公司 | 2021-11-23 | — | — | CN | claimed |
| CN-113493654-A | Photo-thermal dual-curing adhesive and preparation method thereof | 烟台德邦科技股份有限公司 | 2021-10-12 | — | — | CN | claimed |
| CN-113352796-A | Environment-friendly printing process | 上海臻中印务科技有限公司 | 2021-09-07 | — | — | CN | claimed |
| CN-113150494-A | PCB micro-foaming hole plugging resin and preparation method and application thereof | 深圳市百柔新材料技术有限公司 | 2021-07-23 | — | — | CN | claimed |
| CN-105164125-B | 2-phenyl or 2-heteroaryl imidazo [1,2-a ] pyridine derivatives | 豪夫迈·罗氏有限公司 | 2017-10-13 | — | — | CN | claimed |
| CN-105229009-B | 2-phenylimidazo [1,2-A ] pyrimidines as imaging agents | 豪夫迈·罗氏有限公司 | 2017-09-29 | — | — | CN | claimed |
| US-4339448-A | Imidazole-copper complex compounds and fungicides containing them | BASF AKTIENGESELLSCHAFT (DE) | 1982-07-13 | — | — | US | claimed |
| CN-118922510-A | Surface-tolerant adhesive | 亨斯迈先进材料美国有限责任公司 | 2024-11-08 | — | — | CN | disclosed |
| CN-118872047-A | Resin composition for molding, method for producing sealing structure, and sealing structure | 住友电木株式会社 | 2024-10-29 | — | — | CN | disclosed |
| CN-118849473-A | Explosion-proof shell made of epoxy composite material and forming process thereof | 重庆科聚孚新材料有限责任公司 | 2024-10-29 | — | — | CN | disclosed |
| CN-118368804-A | FRP precursor, laminate, metal-clad laminate, printed wiring board, semiconductor package, and method for producing same | 株式会社力森诺科 | 2024-07-19 | — | — | CN | disclosed |
| CN-118082347-A | Prepreg, printed wiring board, semiconductor package, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-05-28 | — | — | CN | disclosed |
| US-6081023-A | Semiconductor device | HITACHI, LTD. (JP) | 2000-06-27 | — | — | US | disclosed |
| US-6069029-A | Semiconductor device chip on lead and lead on chip manufacturing | HITACHI, LTD. (JP) | 2000-05-30 | — | — | US | disclosed |
| US-5981315-A | TRANSFER MOLDING | HITACHI, LTD. (JP) | 1999-11-09 | — | — | US | disclosed |
| US-4339448-A | Imidazole-copper complex compounds and fungicides containing them | BASF AKTIENGESELLSCHAFT (DE) | 1982-07-13 | — | — | US | disclosed |
| US-3932444-A | PLASTICIZERS | E. I. DU PONT DE NEMOURS & CO. (US) | 1976-01-13 | — | — | US | disclosed |