Known targets — ChEMBL curated mechanism
ACEADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2BTKCACNA1CCACNA1DCACNA1FCACNA1SCCR5CPT1BCPT2DPP4DRD1DRD2EGFRERBB2ERBB4HRH1HRH3HTR1AHTR2AHTR2BHTR2CHTR4JAK1JAK2JAK3MPLMTORPPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PPARGSLC6A2SLC6A3SLC6A4SMOTYK2pol
The experimentally established mechanism targets of Maleic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.53 |
| ▸ | LMNA | P02545 | 3/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | TP53 | P04637 | 1/20 | 0.53 |
| ▸ | EGLN1 | Q9GZT9 | 1/20 | 0.53 |
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.53 |
| ▸ | OR51E2 | Q9H255 | 1/20 | 0.41 |
| ▸ | GABRR1 | P24046 | 2/20 | 0.38 |
| ▸ | GABRR2 | P28476 | 2/20 | 0.38 |
| ▸ | BLM | P54132 | 2/20 | 0.38 |
| ▸ | GABRR3 | A8MPY1 | 1/20 | 0.38 |
| ▸ | APEX1 | P27695 | 1/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | HCAR2 | Q8TDS4 | 4/20 | 0.37 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Maleic Acid SCHEMBL10717022 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Fumaric Acid SCHEMBL6482004 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Fumaric Acid SCHEMBL4439688 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Fumaric Acid SCHEMBL19347274 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Fumaric Acid SCHEMBL15689550 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Maleic Acid SCHEMBL29021089 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Fumaric Acid SCHEMBL29021076 | 1.00 | TSHR (0.53) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Maleic Acid SCHEMBL28185921 | 0.97 | TSHR (0.50) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Fumaric Acid SCHEMBL28028716 | 0.97 | TSHR (0.50) | TSHRLMNAALDH1A1TP53EGLN1 | |
| Maleic Acid SCHEMBL28833230 | 0.88 | TSHR (0.41) | TSHRLMNAALDH1A1TP53EGLN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20050218517-A1 | Semiconductor flip-chip package and method for the fabrication thereof | M.A. CAPOTE (US) | 2005-10-06 | — | — | US | disclosed |
| US-6774493-B2 | INTEGRATED CIRCUIT COATED WITH THERMOSETTING POLYMER, WITH HARDENED ADHESIVE POLYMER UNDERFILL ENCAPSULANT INCLUDING INTERMIXED REACTION PRODUCT OF THERMOSETTING POLYMER AND FLUXING AGENT THAT CHEMICALLY IMMOBILIZES FLUX AND BY-PRODUCTS | M. A. CAPOTE | 2004-08-10 | — | — | US | disclosed |
| US-20030218261-A1 | INTEGRATED CIRCUIT COATED WITH THERMOSETTING POLYMER, WITH HARDENED ADHESIVE POLYMER UNDERFILL ENCAPSULANT INCLUDING INTERMIXED REACTION PRODUCT OF THERMOSETTING POLYMER AND FLUXING AGENT THAT CHEMICALLY IMMOBILIZES FLUX AND BY-PRODUCTS | M. A. CAPOTE (US) | 2003-11-27 | — | — | US | disclosed |
| US-6566234-B1 | Semiconductor flip-chip package and method for the fabrication thereof | AGUILA TECHNOLOGIES, INC. | 2003-05-20 | — | — | US | disclosed |
| US-6518677-B1 | Semiconductor flip-chip package and method for the fabrication thereof | Capote, Miguel Albert | 2003-02-11 | — | — | US | disclosed |
| US-6132646-A | ELECTROCONDUCTIVE INK AND CURING ADHESIVE WITH FLUX AND METALS | MIGUEL ALBERT CAPOTE (US) | 2000-10-17 | — | — | US | disclosed |
| EP-1025587-A4 | SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF | AGUILA TECHNOLOGIES INC (US) | 2000-10-04 | — | — | EP | disclosed |
| US-6121689-A | Semiconductor flip-chip package and method for the fabrication thereof | MIGUEL ALBERT CAPOTE (US) | 2000-09-19 | — | — | US | disclosed |
| EP-1025587-A1 | SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF | Aguila Technologies, Inc. (US) | 2000-08-09 | — | — | EP | disclosed |
| US-5985043-A | THERMALLY CURABLE ADHESIVE COMPRISING ACID HAVING TWO OR MORE DOUBLE BONDS AS FLUXING AGENT, DOUBLE BOND CONTAINING DILUENT CAPABLE OF CROSSLINKING FLUXING AGENT, OPTIONALLY FREE RADICAL INITIATOR, RESIN | MIGUEL ALBERT CAPOTE (US) | 1999-11-16 | — | — | US | disclosed |
| WO-1999004430-A1 | SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF | AGUILA TECHNOLOGIES, INC. (US) | 1999-01-28 | — | — | WO | disclosed |