SCHEMBL648284

SCHEMBL648284

CCCOCc1ccc(COCCC)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.43
L3MBTL1 Q9Y468 3/20 0.39
TDP1 Q9NUW8 2/20 0.39
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
PTPN2 P17706 1/20 0.37
PTPN1 P18031 1/20 0.37
PTPN6 P29350 1/20 0.37
AGXT P21549 3/20 0.37
KCNH2 Q12809 1/20 0.36
LTA4H P09960 2/20 0.36
KDM4E B2RXH2 1/20 0.36
NPC1 O15118 1/20 0.36
BRD4 O60885 1/20 0.36
MITF O75030 1/20 0.36
IDO1 P14902 1/20 0.34
ALDH1A1 P00352 1/20 0.34
ESR1 P03372 1/20 0.34
CHRM1 P11229 1/20 0.34
SLC6A2 P23975 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5599359 0.93 NAAA (0.42) TSHRL3MBTL1TDP1CA1CA2
SCHEMBL7838626 0.91 AGXT (0.52) TSHRCA1CA2AGXTKCNH2
SCHEMBL863050 0.91 LTA4H (0.48) TSHRTDP1LTA4HKDM4EIDO1
SCHEMBL10264178 0.89 IDO1 (0.50) L3MBTL1AGXTIDO1LMNA
SCHEMBL21306509 0.89 CYP3A4 (0.50) IDO1
SCHEMBL23267781 0.89 TP53 (0.37) TSHRL3MBTL1TDP1PTPN2PTPN1
SCHEMBL8418497 0.89 IDO1 (0.50) IDO1LMNA
SCHEMBL2267112 0.89 TSHR (0.36) TSHRL3MBTL1TDP1CA1CA2
SCHEMBL7222288 0.89 LTA4H (0.38) TSHRL3MBTL1TDP1CA1CA2
SCHEMBL13799442 0.89 TSHR (0.42) TSHRL3MBTL1TDP1KDM4EIDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022255321-A1 INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
WO-2022255322-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
US-20220216114-A1 METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2022-07-07 US disclosed
EP-3511355-B1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2021-12-29 EP disclosed
US-10703855-B2 Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-07-07 US disclosed
EP-3511355-A1 RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATED BOARD, RESIN SHEET, AND PRINTED CIRCUIT BOARD Mitsubishi Gas Chemical Company, Inc. (JP) 2019-07-17 EP disclosed
US-20190023832-A1 RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2019-01-24 US disclosed
US-20140332984-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO LTD (JP) 2014-11-13 US disclosed
US-8200059-B2 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-06-12 US disclosed
US-20120080808-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI (JP) 2012-04-05 US disclosed
US-4959443-A HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE MITSUI TOATSU CHEMICALS, INC. (JP) 1990-09-25 US disclosed
US-4937318-A Aromatic amine resins MITSUI TOATSU CHEMICALS, INC. (JP) 1990-06-26 US disclosed
EP-0342989-A2 Polymaleimide compounds and process for the preparation thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0342943-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0311387-A2 Aromatic amine resins, their production process and thermosetting resin compositions making use of the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-04-12 EP disclosed
US-4783521-A Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-08 US disclosed
EP-0164705-B1 PROCESS FOR MANUFACTURING PHTHALALDEHYDACETALS BASF Aktiengesellschaft (DE) 1987-09-02 EP disclosed
EP-0233450-A2 Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-08-26 EP disclosed
US-4588482-A Preparation of phthalaldehyde acetals BASF AKTIENGESELLSCHAFT (DE) 1986-05-13 US disclosed
EP-0164705-A2 Process for manufacturing phthalaldehydacetals BASF Aktiengesellschaft (DE) 1985-12-18 EP disclosed