SCHEMBL64900

SCHEMBL64900

CCCCC(=O)OCCN(CCOC(=O)CCCC)CCOC(=O)CCCC

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 1/20 0.65
DGKA P23743 1/20 0.61
PAM P19021 2/20 0.46
NAAA Q02083 1/20 0.45
HTR2C P28335 1/20 0.44
MGLL Q99685 1/20 0.44
PRSS1 P07477 1/20 0.44
PRSS2 P07478 1/20 0.44
PRSS3 P35030 1/20 0.44
MAPT P10636 2/20 0.43
TSHR P16473 2/20 0.43
ALDH1A1 P00352 2/20 0.42
THRB P10828 1/20 0.42
CNR1 P21554 1/20 0.42
FAAH O00519 1/20 0.42
LMNA P02545 1/20 0.42
CYP3A4 P08684 1/20 0.42
ATM Q13315 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
CES2 O00748 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11863179 0.96 DNM1 (0.61) DNM1DGKAPAMNAAAHTR2C
SCHEMBL12120237 0.94 DNM1 (0.73) DNM1DGKAPAMNAAAHTR2C
SCHEMBL12120241 0.92 DNM1 (0.77) DNM1DGKAPAMNAAAHTR2C
SCHEMBL12120239 0.92 DNM1 (0.77) DNM1DGKAPAMNAAAHTR2C
SCHEMBL27608599 0.92 DNM1 (0.61) DNM1DGKAPAMNAAAHTR2C
SCHEMBL9716983 0.92 DNM1 (0.77) DNM1DGKAPAMNAAAHTR2C
SCHEMBL17401272 0.92 DNM1 (0.77) DNM1DGKAPAMNAAAHTR2C
SCHEMBL17401271 0.92 DNM1 (0.77) DNM1DGKAPAMNAAAHTR2C
SCHEMBL17401273 0.92 DNM1 (0.77) DNM1DGKAPAMNAAAHTR2C
SCHEMBL17401264 0.90 DNM1 (0.74) DNM1DGKAPAMNAAAHTR2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 780 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660703-A2 METAL-CONTAINING FILM PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250372377-A1 METAL-CONTAINING FILM PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-04 US disclosed
US-20250251665-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-07 US disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
US-20250147420-A1 Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-08 US disclosed
US-12055853-B2 Photosensitive resin composition, laminate, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-06 US disclosed
US-12032287-B2 Resist material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-09 US disclosed
CN-115044040-B Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method 信越化学工业株式会社 2024-07-02 CN disclosed
US-20010051315-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-13 US disclosed
US-20010044071-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD (JP) 2001-11-22 US disclosed
EP-1149825-A2 Ester compounds, polymers, resist compositions and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2001-10-31 EP disclosed
EP-1150167-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-31 EP disclosed
EP-1150166-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-31 EP disclosed
EP-1148045-A1 Ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-24 EP disclosed
EP-1148044-A1 Ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-24 EP disclosed
US-20010031424-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. OF (JP) 2001-10-18 US disclosed
US-20010026904-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-04 US disclosed
EP-1132774-A2 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-09-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 DNM1 593/4885DGKA 348/4885PAM 777/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.