SCHEMBL649098

SCHEMBL649098

C=C(C)C(=O)OCCOc1ccc(C)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.60
POLB P06746 1/20 0.60
APEX1 P27695 1/20 0.60
TDP1 Q9NUW8 1/20 0.60
L3MBTL1 Q9Y468 2/20 0.53
MAPT P10636 1/20 0.49
MEN1 O00255 1/20 0.49
KMT2A Q03164 1/20 0.49
CA1 P00915 1/20 0.48
CA2 P00918 1/20 0.48
THRB P10828 1/20 0.47
NPC1 O15118 2/20 0.46
HPGD P15428 1/20 0.44
MAOB P27338 1/20 0.44
ATM Q13315 1/20 0.43
LMNA P02545 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.42
DRD2 P14416 1/20 0.42
DRD4 P21917 1/20 0.42
DRD3 P35462 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11997927 0.95 HTT (0.56) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL454606 0.93 POLB (0.67) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL12376911 0.93 HTT (0.53) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL10050684 0.93 TDP1 (0.60) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL4191440 0.92 HTT (0.67) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL13899686 0.92 HTT (0.71) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL12114905 0.90 HTT (0.74) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL12918799 0.90 HTT (0.74) HTTPOLBAPEX1TDP1L3MBTL1
SCHEMBL12039607 0.90 POLB (0.51) HTTPOLBAPEX1TDP1L3MBTL1
P-Xylene SCHEMBL11360520 0.89 THRB (0.57) HTTPOLBAPEX1TDP1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0588534-B1 Radiation curing ink HAYAKAWA RUBBER (JP) 1998-12-02 EP claimed
EP-0588533-B1 Printed thermoplastic resin products and method for printing such products HAYAKAWA RUBBER (JP) 1998-08-12 EP claimed
US-5712022-A Printed thermoplastic resin products and method for printing such products YOSHINO KOGYOSHO CO., LTD. (JP) 1998-01-27 US claimed
US-5587405-A RADIATION CURABLE INK COMPOSITION INCLUDING VEHICLE MIXTURE HAVING SPECIFIED ACID VALUE YOSHINO KOGYOSHO CO., LTD. (JP) 1996-12-24 US claimed
CN-114437269-B Optical element, optical device, imaging device, and compound 佳能株式会社 2024-06-07 CN disclosed
CN-110462449-B Optical element, material, optical device and compound 佳能株式会社 2023-08-18 CN disclosed
CN-116589615-A Optical element, material, optical device and compound 佳能株式会社 2023-08-15 CN disclosed
US-20230056225-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-23 US disclosed
US-20230028822-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-26 US disclosed
US-20230002520-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-05 US disclosed
US-20220404709-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2022-12-22 US disclosed
EP-4019558-A1 CURABLE INK COMPOSITION, CURED MATERIAL AND NANOCOMPOSITE TOKYO OHKA KOGYO CO., LTD. (JP) 2022-06-29 EP disclosed
US-5908876-A Optical resin composition comprising a thiourethane prepolymer and use thereof MITSUI CHEMICALS, INC. (JP) 1999-06-01 US disclosed
EP-0588534-B1 Radiation curing ink HAYAKAWA RUBBER (JP) 1998-12-02 EP disclosed
US-5811424-A CONTROL OF DOWNY MILDEW, LATE BLIGHT KUMIAI CHEMICAL INDUSTRY CO., LTD. (JP) 1998-09-22 US disclosed
EP-0588533-B1 Printed thermoplastic resin products and method for printing such products HAYAKAWA RUBBER (JP) 1998-08-12 EP disclosed
US-5723469-A Amino-acid amide derivatives, agricultural or horticultural fungicides, and method for producing the same KUMIAI CHEMICAL INDUSTRY CO., LTD. (JP) 1998-03-03 US disclosed
EP-0321618-B1 PHOTOSENSITIVE HARDENABLE COMPOSITIONS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-02-17 EP disclosed
US-4885229-A CONTAINING ACRYLATED ESTERS 501 DAICEL CHEMICAL INDUSTRIES LTD. (JP) 1989-12-05 US disclosed
EP-0321618-A1 Photosensitive hardenable compositions DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1989-06-28 EP disclosed