Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 2/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12098093 | 0.79 | ALDH1A1 (0.43) | EPHX1ALDH1A1GAANPSR1 | |
| SCHEMBL28007959 | 0.72 | EPHX1 (0.43) | EPHX1ALDH1A1NPSR1 | |
| SCHEMBL43523 | 0.69 | EPHX1 (0.48) | EPHX1ALDH1A1 | |
| SCHEMBL4356901 | 0.68 | TSHR (0.45) | EPHX1ALDH1A1 | |
| SCHEMBL14916107 | 0.67 | EPHX1 (0.52) | EPHX1ALDH1A1 | |
| SCHEMBL2867264 | 0.67 | EPHX1 (0.52) | EPHX1ALDH1A1 | |
| SCHEMBL479250 | 0.67 | EPHX1 (0.52) | EPHX1ALDH1A1 | |
| SCHEMBL27921767 | 0.67 | — | — | |
| SCHEMBL27524392 | 0.66 | — | — | |
| SCHEMBL222929 | 0.66 | GSTP1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1360069-B1 | IN SITU MICROENCAPSULATED ADHESIVE | APPLETON PAPER INC (US) | 2010-02-10 | — | — | EP | claimed |
| US-7371499-B2 | Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-05-13 | — | — | US | claimed |
| US-20070128540-A1 | PHOTORESIST RESIN COMPOSITION, METHOD OF FORMING A PHOTORESIST PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-07 | — | — | US | claimed |
| EP-1360069-A4 | IN SITU MICROENCAPSULATED ADHESIVE | APPLETON PAPER INC (US) | 2006-05-10 | — | — | EP | claimed |
| US-6686120-B2 | THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-02-03 | — | — | US | claimed |
| EP-1360069-A2 | IN SITU MICROENCAPSULATED ADHESIVE | Appleton Papers Inc. (US) | 2003-11-12 | — | — | EP | claimed |
| US-20030134222-A1 | Photoresist composition and method of forming pattern using the same | SAMSUNG ELECTRONICS CO., LTD. | 2003-07-17 | — | — | US | claimed |
| US-20020169233-A1 | In situ microencapsulated adhesive | IPS ADHESIVES LLC | 2002-11-14 | — | — | US | claimed |
| WO-2002020683-A2 | IN SITU MICROENCAPSULATED ADHESIVE | APPLETON PAPERS INC. (US) | 2002-03-14 | — | — | WO | claimed |
| EP-3436210-B1 | FUNCTIONALIZED LAMINATED OPTICAL ELEMENT WITH IMPROVED EDGING RESISTANCE | ESSILOR INT (FR) | 2024-06-12 | — | — | EP | disclosed |
| US-11982941-B2 | Flexographic printing plate precursor | SUMITOMO RIKO COMPANY LIMITED (JP) | 2024-05-14 | — | — | US | disclosed |
| CN-108572516-B | Positive photosensitive resin composition, display device and pattern forming method thereof | 株式会社东进世美肯 | 2023-10-17 | — | — | CN | disclosed |
| US-11772343-B2 | Functionalized laminated optical element with improved edging resistance | ESSILOR INTERNATIONAL (FR) | 2023-10-03 | — | — | US | disclosed |
| EP-3650239-B1 | FLEXOGRAPHIC PRINTING PLATE PRECURSOR | SUMITOMO RIKO CO LTD (JP) | 2023-04-19 | — | — | EP | disclosed |
| US-6686120-B2 | THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-02-03 | — | — | US | disclosed |
| EP-1360069-A2 | IN SITU MICROENCAPSULATED ADHESIVE | Appleton Papers Inc. (US) | 2003-11-12 | — | — | EP | disclosed |
| US-20030134222-A1 | Photoresist composition and method of forming pattern using the same | SAMSUNG ELECTRONICS CO., LTD. | 2003-07-17 | — | — | US | disclosed |
| US-6592990-B2 | Pressure sensitive or flowable | APPLETON PAPERS INC. | 2003-07-15 | — | — | US | disclosed |
| US-20020169233-A1 | In situ microencapsulated adhesive | IPS ADHESIVES LLC | 2002-11-14 | — | — | US | disclosed |
| WO-2002020683-A2 | IN SITU MICROENCAPSULATED ADHESIVE | APPLETON PAPERS INC. (US) | 2002-03-14 | — | — | WO | disclosed |