SCHEMBL65044

SCHEMBL65044

CO[C](OC)C(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2148561 0.67
SCHEMBL559834 0.65
SCHEMBL9646996 0.65
SCHEMBL176754 0.65
SCHEMBL6372840 0.64
SCHEMBL4386797 0.64
SCHEMBL10632960 0.62
SCHEMBL14893421 0.61 ALDH1A1 (0.35)
SCHEMBL22151858 0.60
SCHEMBL5188375 0.60 TSHR (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 523 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3435160-B1 NEGATIVE PHOTORESIST COMPOSITION FOR KRF LASER, HAVING HIGH RESOLUTION AND HIGH ASPECT RATIO YOUNG CHANG CHEMICAL CO LTD (KR) 2022-05-04 EP claimed
WO-2024128190-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 日産化学株式会社 2024-06-20 WO disclosed
WO-2024128157-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 日産化学株式会社 2024-06-20 WO disclosed
US-20240192591-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-13 US disclosed
US-12001139-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-04 US disclosed
US-20240176238-A1 SULFONIUM SALT, RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-05-30 US disclosed
US-20240176235-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-05-30 US disclosed
EP-4375750-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE ADEKA CORPORATION (JP) 2024-05-29 EP disclosed
CN-118103774-A Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and pattern forming method 信越化学工业株式会社 2024-05-28 CN disclosed
US-11994799-B2 Negative resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-05-28 US disclosed
US-20040241577-A1 Resist lower layer film material and method for forming a pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-02 US disclosed
US-20040185372-A1 Dye-containing curable composition, color filter, and process of preparing color filter FUJI PHOTO FILM CO., LTD. 2004-09-23 US disclosed
US-20040009414-A1 Dye-containing curable composition, color filter and method of manufacturing the same FUJI PHOTO FILM CO., LTD. 2004-01-15 US disclosed
US-20030232259-A1 Dye-containing curable composition, color filter, and producing process thereof FUJI PHOTO FILM CO., LTD. 2003-12-18 US disclosed
EP-0823661-B1 Composition for anti-reflective coating material FUJI PHOTO FILM CO LTD (JP) 2001-07-04 EP disclosed
US-6248500-B1 ACRYLIC POLYMERS AND PHENOL, NAPHTHOL OR HYDROXYANTHRACENE COMPOUNDS FUJI PHOTO FILM CO., LTD. (JP) 2001-06-19 US disclosed
US-6090531-A UNDERGOES NO INTERMIXING WITH THE RESIST LAYER, PROVIDES AN EXCELLENT RESIST PATTERN AND SHOWS A HIGHER DRY ETCHING RATE THAN RESIST AND A RESIST PATTERN FORMATION PROCESS FUJI PHOTO FILM CO., LTD. (JP) 2000-07-18 US disclosed
EP-0823661-A1 Composition for anti-reflective coating material FUJI PHOTO FILM CO., LTD. (JP) 1998-02-11 EP disclosed
US-5362721-A Corticoid-17-alkyl-carbonates substituted in the 17-position, process for their preparation and pharmaceuticals containing them HOECHST AKTIENGESELLSCHAFT (DE) 1994-11-08 US disclosed
EP-0590033-A1 POLYESTER-BASED COATING COMPOSITIONS HAVING HIGH PIGMENT-TO-BINDER RATIOS EXXON CHEMICAL PATENTS INC. (US) 1994-04-06 EP disclosed