Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 5/20 | 0.40 |
| ▸ | RAB9A | P51151 | 3/20 | 0.40 |
| ▸ | NPC1 | O15118 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 2/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | POLB | P06746 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | MITF | O75030 | 1/20 | 0.38 |
| ▸ | GFER | P55789 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.38 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.38 |
| ▸ | GLA | P06280 | 1/20 | 0.38 |
| ▸ | MAOB | P27338 | 5/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21468659 | 0.93 | AR (0.42) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL14223513 | 0.84 | TSHR (0.48) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL29962772 | 0.83 | ALDH1A1 (0.52) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL648768 | 0.82 | ALDH1A1 (0.46) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL8405569 | 0.82 | ALDH1A1 (0.36) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL8143487 | 0.81 | TSHR (0.47) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL10715067 | 0.81 | MAOB (0.43) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL1352268 | 0.81 | MAPT (0.43) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL4847389 | 0.79 | ALDH1A1 (0.36) | ALDH1A1TSHRTDP1CYP3A4MAPT | |
| SCHEMBL8970419 | 0.77 | ALDH1A1 (0.59) | ALDH1A1TSHRTDP1CYP3A4MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 336 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7459047-B2 | Preparation of flexible copper foil/polyimide laminate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-12-02 | — | — | US | claimed |
| US-5601905-A | Laminate for insulation protection of circuit boards | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1997-02-11 | — | — | US | claimed |
| US-5399655-A | Acid-labile poly(amic acetal ester) | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-03-21 | — | — | US | claimed |
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| EP-3633455-B1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-04-08 | — | — | EP | disclosed |
| EP-3859447-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-11-19 | — | — | EP | disclosed |
| US-12473403-B2 | Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor | FUJIFILM CORPORATION (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12422750-B2 | Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device | FUJIFILM CORPORATION (JP) | 2025-09-23 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-4939039-A | Noncurlling, polyamideimides | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1990-07-03 | — | — | US | disclosed |
| EP-0355927-A2 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1990-02-28 | — | — | EP | disclosed |
| US-4847353-A | POLYAMIDEIMIDE COPOLYMERS | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1989-07-11 | — | — | US | disclosed |
| EP-0297139-A1 | FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1989-01-04 | — | — | EP | disclosed |
| US-4792476-A | AROMATIC POLYIMIDES | HITACHI, LTD. (JP) | 1988-12-20 | — | — | US | disclosed |
| EP-0271736-A1 | Resins of low thermal expansivity | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1988-06-22 | — | — | EP | disclosed |
| US-4690999-A | MOLECULARLY-ORIENTED POLYIMIDES BASED ON PARA-AROMATIC DIAMINES; FILMS; PROTECTIVE COATINGS; INTEGRATED CIRCUITS | HITACHI, LTD. (JP) | 1987-09-01 | — | — | US | disclosed |
| US-4641924-A | Liquid crystal device | HITACHI, LTD. (JP) | 1987-02-10 | — | — | US | disclosed |
| EP-0133533-A2 | Low thermal expansion resin material for a wiring insulating film. | HITACHI, LTD. (JP) | 1985-02-27 | — | — | EP | disclosed |