SCHEMBL6512431

SCHEMBL6512431

CCc1cccc([Si](OC)(OC)OC)c1[Si](OC)(OC)OC

nearest known ligand 0.39

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 4/20 0.39
GABRB2 P47870 4/20 0.39
TP53 P04637 1/20 0.35
ADRA2A P08913 1/20 0.33
ADRA2B P18089 1/20 0.33
ADRA2C P18825 1/20 0.33
KCNH2 Q12809 3/20 0.32
SCN5A Q14524 3/20 0.32
CACNA1C Q13936 2/20 0.32
CYP1A2 P05177 1/20 0.32
NPBWR1 P48145 1/20 0.31
TAAR1 Q96RJ0 2/20 0.31
HTR1A P08908 1/20 0.31
MAPT P10636 2/20 0.31
L3MBTL1 Q9Y468 2/20 0.31
NPSR1 Q6W5P4 1/20 0.31
ELANE P08246 2/20 0.30
HPGD P15428 1/20 0.30
ATM Q13315 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL669702 0.82 GABRA1 (0.38) GABRA1GABRB2TP53ADRA2AADRA2B
SCHEMBL1639805 0.81 KDM4E (0.31)
SCHEMBL10709287 0.81 GABRA1 (0.39) GABRA1GABRB2TP53ADRA2AADRA2B
SCHEMBL6515560 0.79 GABRA1 (0.38) GABRA1GABRB2TP53ADRA2AADRA2B
SCHEMBL13027818 0.74 CYP1A2 (0.33) KCNH2SCN5ACACNA1CCYP1A2NPBWR1
SCHEMBL4420821 0.72 IDO1 (0.31) TAAR1L3MBTL1
SCHEMBL13027802 0.72 CA1 (0.42) TP53ADRA2BCYP1A2MAPTL3MBTL1
Ammonia Solution, Strong SCHEMBL22151554 0.72 PDCD1LG2 (0.37) GABRA1GABRB2TP53KCNH2SCN5A
SCHEMBL20584031 0.71 HSPA5 (0.36) GABRA1GABRB2TAAR1MAPT
SCHEMBL31373304 0.71 PDK2 (0.35) GABRA1GABRB2TP53ADRA2AADRA2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2005100426-A1 A NANOPARTICLE OF CORE-SHELL TYPE, A METHOD FOR PREPARING THE SAME, A METHOD FOR PREPARING A LOW DIELECTRIC INSULATION FILM BY USING THE SAME, AND A LOW DIELECTRIC INSULATION FILM PREPARED THEREFROM POSTECH FOUNDATION (KR) 2005-10-27 WO claimed
US-9136244-B2 Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film HITACHI, LTD. (JP) 2015-09-15 US disclosed
US-20130161807-A1 METHOD FOR JOINTING METAL MEMBER AND RESIN AND JOINTED BODY THEREOF HITACHI, LTD. (JP) 2013-06-27 US disclosed
US-20120205010-A1 CORROSION CONTROL METHOD OF METAL HITACHI, LTD. 2012-08-16 US disclosed
WO-2005100426-A1 A NANOPARTICLE OF CORE-SHELL TYPE, A METHOD FOR PREPARING THE SAME, A METHOD FOR PREPARING A LOW DIELECTRIC INSULATION FILM BY USING THE SAME, AND A LOW DIELECTRIC INSULATION FILM PREPARED THEREFROM POSTECH FOUNDATION (KR) 2005-10-27 WO disclosed