SCHEMBL669702

SCHEMBL669702

CCc1ccccc1[Si](OC)(OC)OC

nearest known ligand 0.38

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 4/20 0.38
GABRB2 P47870 4/20 0.38
L3MBTL1 Q9Y468 3/20 0.37
MAPT P10636 2/20 0.37
NPSR1 Q6W5P4 1/20 0.37
HPGD P15428 1/20 0.36
ATM Q13315 1/20 0.36
MGLL Q99685 1/20 0.35
TP53 P04637 2/20 0.34
NPBWR1 P48145 1/20 0.33
KDM4E B2RXH2 1/20 0.33
NISCH Q9Y2I1 1/20 0.33
ADRA2A P08913 1/20 0.32
ADRA2B P18089 1/20 0.32
ADRA2C P18825 1/20 0.32
CYP2D6 P10635 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28950399 0.85 MAPT (0.32) GABRA1GABRB2L3MBTL1MAPTNPSR1
SCHEMBL4420821 0.85 IDO1 (0.31) L3MBTL1KDM4E
SCHEMBL20584031 0.84 HSPA5 (0.36) GABRA1GABRB2MAPTKDM4E
SCHEMBL10907578 0.83 ADRA2B (0.37) HPGDKDM4ENISCHADRA2AADRA2B
SCHEMBL1562731 0.83 GABRA1 (0.38) GABRA1GABRB2L3MBTL1MAPTNPSR1
SCHEMBL10709287 0.82 GABRA1 (0.39) GABRA1GABRB2L3MBTL1MAPTNPSR1
SCHEMBL6512431 0.82 GABRA1 (0.39) GABRA1GABRB2L3MBTL1MAPTNPSR1
SCHEMBL4843001 0.81 IDO1 (0.31) KDM4E
SCHEMBL4844480 0.81 ALDH1A1 (0.31) KDM4E
SCHEMBL2108819 0.81 IDO1 (0.40) KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0119011-B1 ADHESIVE PROCESS HERCULES INCORPORATED (US) 1987-11-04 EP claimed
WO-2024190380-A1 SILICON-CONTAINING RESIN COMPOSITION PURIFIED PRODUCT MANUFACTURING METHOD, PATTERN FORMATION METHOD, AND SILICON-CONTAINING RESIN COMPOSITION PURIFIED PRODUCT 東京応化工業株式会社 2024-09-19 WO disclosed
CN-107076894-B Infrared shielding composition, cured film, and solid-state imaging device JSR株式会社 2020-01-31 CN disclosed
US-10234762-B2 Pattern-forming method JSR CORPORATION (JP) 2019-03-19 US disclosed
US-10025188-B2 Resist pattern-forming method JSR CORPORATION (JP) 2018-07-17 US disclosed
US-20170322492-A1 RESIST PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-11-09 US disclosed
CN-107076894-A Infrared shielding composition, cured film, and solid-state imaging device JSR株式会社 2017-08-18 CN disclosed
US-20170003592-A1 PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-01-05 US disclosed
US-20160336512-A1 METHOD OF FORMING ORGANIC SEMICONDUCTOR FILM AND ORGANIC SEMICONDUCTOR FILM FORMING DEVICE FUJIFILM CORPORATION (JP) 2016-11-17 US disclosed
US-20160320705-A1 RESIST PATTERN-FORMING METHOD JSR CORPORATION (JP) 2016-11-03 US disclosed
US-6395856-B1 CURABLE POLYSILOXANES FOR PROTECTIVE COATINGS FOR WIRES CROMPTON CORPORATION 2002-05-28 US disclosed
US-6258914-B1 POLYSILOXANES C. K. WITCO CORPORATION 2001-07-10 US disclosed
US-6140445-A ALKOXY SILANE OLIGOMERS WHICH HAVE A NON-HYDROLYZABLE CARBON BRIDGED BOND TO ANOTHER SILANE FUNCTIONALITY CROMPTON CORPORATION (US) 2000-10-31 US disclosed
EP-0991698-A1 SILICONE OLIGOMERS AND CURABLE COMPOSITIONS CONTAINING SAME CK WITCO CORPORATION (US) 2000-04-12 EP disclosed
WO-1999054386-A1 SILICONE OLIGOMERS AND CURABLE COMPOSITIONS CONTAINING SAME WITCO CORPORATION (US) 1999-10-28 WO disclosed
EP-0076656-B1 SOLVENT-SOLUBLE ORGANOPOLYSILSESQUIOXANES, PROCESSES FOR PRODUCING THE SAME, AND COMPOSITIONS AND SEMICONDUCTOR DEVICES USING THE SAME JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1988-06-01 EP disclosed
EP-0119011-B1 ADHESIVE PROCESS HERCULES INCORPORATED (US) 1987-11-04 EP disclosed
US-4626556-A LADDER POLYMERS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1986-12-02 US disclosed
EP-0119011-A1 Adhesive process HERCULES INCORPORATED (US) 1984-09-19 EP disclosed
US-4447495-A AN AZIDOSILANE COUPLING AGENT FOR ADHEARING POLYMER AND SILICEOUS MATERIAL HERCULES, INCORPORATED (US) 1984-05-08 US disclosed