SCHEMBL6519213

SCHEMBL6519213

Oc1[c]ccc(C#Cc2ccccc2)c1C#Cc1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.43
MAPT P10636 3/20 0.40
ALDH1A1 P00352 3/20 0.40
NPC1 O15118 2/20 0.40
MEN1 O00255 2/20 0.40
CYP1A2 P05177 2/20 0.40
CYP3A4 P08684 2/20 0.40
CYP2C9 P11712 2/20 0.40
HPGD P15428 2/20 0.40
CYP2C19 P33261 2/20 0.40
KMT2A Q03164 2/20 0.40
HSD17B10 Q99714 2/20 0.40
KDM4E B2RXH2 2/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
RAB9A P51151 1/20 0.39
CA12 O43570 1/20 0.35
CA2 P00918 1/20 0.35
CA9 Q16790 1/20 0.35
HNF4A P41235 1/20 0.34
CYP2D6 P10635 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2190184 0.80 APP (0.44) APPMAPTALDH1A1NPC1MEN1
SCHEMBL3792911 0.74 APP (0.63) APPMAPTALDH1A1NPC1MEN1
SCHEMBL3797526 0.72 APP (0.60) APPMAPTALDH1A1NPC1MEN1
SCHEMBL21858036 0.70 APP (0.46) APPMAPTALDH1A1NPC1MEN1
SCHEMBL5141153 0.69 APP (0.55) APPMAPTALDH1A1NPC1MEN1
SCHEMBL5052289 0.69 APP (0.55) APPMAPTALDH1A1NPC1MEN1
SCHEMBL3796509 0.68 APP (0.80) APPMAPTALDH1A1NPC1MEN1
SCHEMBL2190753 0.67 APP (0.52) APPMAPTALDH1A1NPC1MEN1
SCHEMBL5871989 0.66 APP (0.75) APPMAPTALDH1A1NPC1MEN1
SCHEMBL2114742 0.66 APP (0.75) APPMAPTALDH1A1NPC1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6881811-B2 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards ASAHI GLASS COMPANY, LIMITED (JP) 2005-04-19 US disclosed
US-20040147710-A1 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards ASAHI GLASS COMPANY LIMITED (JP) 2004-07-29 US disclosed