SCHEMBL2898358

SCHEMBL2898358

C(OCC1CO1)C1CO1.Oc1ccc(-c2ccc(O)cc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.44
ESR2 Q92731 1/20 0.44
TSHR P16473 3/20 0.43
TDP1 Q9NUW8 1/20 0.41
MGLL Q99685 4/20 0.41
ALDH1A1 P00352 2/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
TP53 P04637 1/20 0.40
CYP3A4 P08684 1/20 0.40
HIF1A Q16665 1/20 0.40
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methane SCHEMBL28842587 0.98 ESR1 (0.42) ESR1ESR2TSHRTDP1MGLL
Propane SCHEMBL28322219 0.94 SMN1; SMN2 (0.43) ESR1ESR2TSHRTDP1MGLL
Hydroquinone SCHEMBL50263 0.94 TSHR (0.48) TSHRTDP1MGLLALDH1A1SMN1; SMN2
SCHEMBL6522595 0.93 MMP3 (0.52) TDP1MGLLALDH1A1
Ether SCHEMBL17373053 0.91 SMN1; SMN2 (0.41) ESR1ESR2TSHRTDP1MGLL
Biphenyl SCHEMBL27619347 0.87 TDP1 (0.50) TSHRTDP1MGLLALDH1A1SMN1; SMN2
Biphenyl SCHEMBL3958846 0.87 TDP1 (0.50) TSHRTDP1MGLLALDH1A1SMN1; SMN2
4-Aminophenol SCHEMBL5675745 0.85 ALDH1A1 (0.48) ESR1ESR2TSHRTDP1ALDH1A1
P-Cresol SCHEMBL3682617 0.85 ACHE (0.48) ESR2TSHRTDP1ALDH1A1SMN1; SMN2
SCHEMBL49595 0.85 ESR1 (0.52) ESR1ESR2TSHRTDP1MGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 204 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116901550-B High-heat-dissipation liquid crystal epoxy resin copper-clad plate and preparation method thereof 江门建滔电子发展有限公司 2024-02-23 CN claimed
CN-116901550-A High-heat-dissipation liquid crystal epoxy resin copper-clad plate and preparation method thereof 江门建滔电子发展有限公司 2023-10-20 CN claimed
CN-115895574-A UVLED point light source solidified ring winding glue and matched optical fiber ring solidifying device 武汉长盈通光电技术股份有限公司 2023-04-04 CN claimed
CN-113461909-B Intelligent lubricating material and preparation method and application thereof 中国科学院兰州化学物理研究所 2022-04-19 CN claimed
CN-111484854-B Method for preparing liquid crystal elastomer intelligent material with three-dimensional reversible drive 清华大学 2022-03-01 CN claimed
CN-113461909-A Intelligent lubricating material and preparation method and application thereof 中国科学院兰州化学物理研究所 2021-10-01 CN claimed
CN-112409575-B Liquid crystal epoxy shape memory polymer, preparation method and application thereof, and reprogramming method 中国科学院兰州化学物理研究所 2021-08-20 CN claimed
CN-112409575-A Liquid crystal epoxy shape memory polymer, preparation method and application thereof, and reprogramming method 中国科学院兰州化学物理研究所 2021-02-26 CN claimed
CN-111484854-A Method for preparing liquid crystal elastomer intelligent material with three-dimensional reversible drive 清华大学 2020-08-04 CN claimed
CN-107934948-B Preparation method of graphene and graphene 大连理工大学 2019-12-27 CN claimed
US-20030149219-A1 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom BORIACK CLINTON J (US) 2003-08-07 US claimed
US-20030105268-A1 Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom DOW GLOBAL TECHNOLOGIES INC. 2003-06-05 US claimed
EP-1290058-A2 PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2003-03-12 EP claimed
US-20020082322-A1 Flame retarded epoxy resin composition CHANG CHUN PLASTICS, CO., LTD. (TW) 2002-06-27 US claimed
JP-2002517387-A 2002-06-18 JP claimed
US-20020045707-A1 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom DOW GLOBAL TECHNOLOGIES INC. 2002-04-18 US claimed
WO-2001088013-A2 PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC (US) 2001-11-22 WO claimed
EP-1080084-A2 PROCESS FOR EPOXIDATION OF ARYL ALLYL ETHERS THE DOW CHEMICAL COMPANY (US) 2001-03-07 EP claimed
US-6087513-A REACTION OF ALLYL ARYL ETHER WITH HYDROGEN PEROXIDE IN THE PRESENCE OF TRANSITION METALS FOR OXIDATION THE DOW CHEMICAL COMPANY (US) 2000-07-11 US claimed
WO-1999062894-A2 PROCESS FOR EPOXIDATION OF ARYL ALLYL ETHERS THE DOW CHEMICAL COMPANY (US) 1999-12-09 WO claimed