SCHEMBL652562

SCHEMBL652562

Nc1ccc(Oc2ccc(S(=O)(=O)c3ccc(Oc4ccc(N)c(C(F)(F)F)c4)cc3)cc2)cc1C(F)(F)F

nearest known ligand 0.51

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
FFAR4 Q5NUL3 11/20 0.51
FFAR1 O14842 3/20 0.45
HTT P42858 3/20 0.44
TDP1 Q9NUW8 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
SOS1 Q07889 3/20 0.43
ALDH1A1 P00352 2/20 0.42
SMN1; SMN2 Q16637 1/20 0.41
PKM P14618 1/20 0.41
HTR6 P50406 1/20 0.41
PTPN1 P18031 1/20 0.41
CHEK2 O96017 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8146457 0.87 NR4A1 (0.52) FFAR4TDP1L3MBTL1ALDH1A1SMN1; SMN2
SCHEMBL2807442 0.86 HTT (0.45) FFAR4HTTTDP1L3MBTL1SOS1
SCHEMBL710315 0.85 NR4A1 (0.54) FFAR4FFAR1L3MBTL1ALDH1A1SMN1; SMN2
SCHEMBL2807270 0.84 HTT (0.44) FFAR4HTTTDP1L3MBTL1SOS1
SCHEMBL29896686 0.82 ALDH1A1 (0.52) FFAR4TDP1ALDH1A1SMN1; SMN2
SCHEMBL30287636 0.82 NR4A1 (0.47) FFAR4TDP1L3MBTL1ALDH1A1SMN1; SMN2
SCHEMBL649034 0.82 NR4A1 (0.47) FFAR4TDP1L3MBTL1ALDH1A1SMN1; SMN2
SCHEMBL7190049 0.82 ALDH1A1 (0.52) FFAR4TDP1ALDH1A1SMN1; SMN2
SCHEMBL2810971 0.81 FFAR4 (0.54) FFAR4FFAR1ALDH1A1PKMHTR6
SCHEMBL21332700 0.80 SCN9A (0.47) FFAR4L3MBTL1SOS1ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7459047-B2 Preparation of flexible copper foil/polyimide laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-02 US claimed
US-5601905-A Laminate for insulation protection of circuit boards NIPPON STEEL CHEMICAL CO., LTD. (JP) 1997-02-11 US claimed
EP-2006086-B1 PROCESS FOR PRODUCTION OF SOFT MAGNETIC METAL STRIP LAMINATE HITACHI METALS LTD (JP) 2019-07-31 EP disclosed
US-8118970-B2 Soft magnetic metal strip laminate and process for production thereof HITACHI METALS, LTD. (JP) 2012-02-21 US disclosed
US-20100286353-A1 ACETYLENE COMPOUND, SALT THEREOF, CONDENSATE THEREOF, AND COMPOSITION THEREOF FUJIFILM CORPORATION (JP) 2010-11-11 US disclosed
US-20100240908-A1 ACETYLENE COMPOUND FUJIFILM CORPORATION (JP) 2010-09-23 US disclosed
EP-2202220-A1 ACETYLENE COMPOUND, SALT THEREOF, CONDENSATE THEREOF, AND COMPOSITION THEREOF Fujifilm Corporation (JP) 2010-06-30 EP disclosed
EP-2202221-A1 ACETYLENE COMPOUND Fujifilm Corporation (JP) 2010-06-30 EP disclosed
EP-2006086-A9 SOFT MAGNETIC METAL STRIP LAMINATE AND PROCESS FOR PRODUCTION THEREOF Hitachi Metals, Limited (JP) 2009-07-29 EP disclosed
US-20090181259-A1 SOFT MAGNETIC METAL STRIP LAMINATE AND PROCESS FOR PRODUCTION THEREOF HITACHI METALS, LTD. (JP) 2009-07-16 US disclosed
US-20090101280-A1 METHOD OF PRODUCING FLEXIBLE SINGLE-SIDED POLYIMIDE COPPER-CLAD LAMINATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-04-23 US disclosed
US-7459047-B2 Preparation of flexible copper foil/polyimide laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-02 US disclosed
US-20060191632-A1 Method for producing flexible metal foil-polyimide laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-08-31 US disclosed
US-7060784-B2 Polyimide precursor resin solution composition sheet SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
US-20060042750-A1 Preparation of flexible copper foil/polyimide laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-03-02 US disclosed
US-20050214552-A1 Flexible metal foil-polyimide laminate and making method SHIN-ETSU CHEMICAL CO., LTD. 2005-09-29 US disclosed
US-20050121138-A1 Preparation of flexible metal foil/polyimide laminate SHIN-ETSU CHEMICAL CO., LTD. 2005-06-09 US disclosed
US-20040265601-A1 Polyimide precursor resin solution composition sheet SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-30 US disclosed
US-6303230-B1 FOR THE MANUFACTURE OF HARD DISK DRIVE(HDD) SUSPENSIONS OF AN INTEGRATED CIRCUIT/WIRING STRUCTURE WITH HIGH ACCURACY NIPPON STEEL CHEMICAL CO., LTD. (JP) 2001-10-16 US disclosed
US-5601905-A Laminate for insulation protection of circuit boards NIPPON STEEL CHEMICAL CO., LTD. (JP) 1997-02-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100240908-A1 ACETYLENE COMPOUND NAT1, KATNA1, KAT2B FFAR4 4585/4885FFAR1 3015/4885HTT 2040/4885
US-20100286353-A1 ACETYLENE COMPOUND, SALT THEREOF, CONDENSATE THEREOF, AND COMPOSITION THEREOF KAT8, HDAC10, SSRP1 FFAR4 4646/4885FFAR1 3769/4885HTT 928/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.