SCHEMBL652667

SCHEMBL652667

CCC(=NO)C(C)(C)[SiH3].CCC(CC)=NO.CCC(CC)=NO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4452787 0.91
SCHEMBL20873208 0.74 ALDH1A1 (0.33)
SCHEMBL273798 0.74
Hydrochloric Acid SCHEMBL27730476 0.71
SCHEMBL28131033 0.71
SCHEMBL9492809 0.69
SCHEMBL13317663 0.69
SCHEMBL28844969 0.67 GAA (0.33)
Benzene SCHEMBL28158299 0.66 ATM (0.35)
SCHEMBL8846514 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1634928-B1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHINETSU CHEMICAL CO (JP) 2007-10-31 EP claimed
EP-3530702-B1 THERMOCONDUCTIVE SILICONE COMPOSITION SHINETSU CHEMICAL CO (JP) 2024-02-21 EP disclosed
WO-2023190934-A1 DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME 有限会社ETIC 2023-10-05 WO disclosed
WO-2023068244-A1 MEMBRANE FORMATION COMPOSITION, AND GAS PERMEATION MEMBRANE 日産化学株式会社 2023-04-27 WO disclosed
US-20220401894-A1 MEMBRANE FORMATION COMPOSITION, AND GAS PERMEATION MEMBRANE NISSAN CHEMICAL CORPORATION (JP) 2022-12-22 US disclosed
US-11248154-B2 Thermoconductive silicone composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-15 US disclosed
EP-3401366-B1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHINETSU CHEMICAL CO (JP) 2020-08-26 EP disclosed
US-10689515-B2 Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-23 US disclosed
EP-3530702-A1 THERMOCONDUCTIVE SILICONE COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 2019-08-28 EP disclosed
US-20190256756-A1 THERMOCONDUCTIVE SILICONE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-08-22 US disclosed
EP-0574928-A2 Fluorosilicone resin and curable fluorosilicone resin composition Dow Corning Toray Silicone Company, Limited (JP) 1993-12-22 EP disclosed
US-5145907-A Using a divalent tin catalyst to effect crosslinking; shelf life; dry to elastomer films reinforced with colloidal silica DOW CORNING CORPORATION (US) 1992-09-08 US disclosed
EP-0497318-A2 Room temperature curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1992-08-05 EP disclosed
US-5026812-A Organopolysiloxane composition curable to an elastomer and use thereof DOW CORNING GMBH (AT) 1991-06-25 US disclosed
US-5013781-A Room temperature curing; polydimethylsiloxane; polysiloxane with trimethylsilanol, dimethylsilanol and silica units; filler; alkoxysilane; ketoxime silicon compound DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 1991-05-07 US disclosed
EP-0420522-A2 Precured silicone emulsion DOW CORNING CORPORATION (US) 1991-04-03 EP disclosed
US-4954565-A SHELF-STABLE WHEN CONTAINING COLLOIDAL SILICA FILLER; USING A STANNOUS CARBOXYLATE CURING CATALYST DOW CORNING CORPORATION (US) 1990-09-04 US disclosed
EP-0370643-A2 Organopolysiloxane composition curable to an elastomer and use thereof DOW CORNING GmbH (DE) 1990-05-30 EP disclosed
EP-0261418-A2 Gasket/packing material with excellent adhesiveness and resistance to coolants Toray Silicone Company, Ltd. (JP) 1988-03-30 EP disclosed
US-4546017-A WITH TITANIUM COMPLEX AND SILANE CROSSLINKING AGENT DOW CORNING LIMTED (GB) 1985-10-08 US disclosed