SCHEMBL6542837

SCHEMBL6542837

Cc1cccc2nc(Cc3ccccc3)[nH]c12

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.60
KMT2A Q03164 2/20 0.55
PKM P14618 2/20 0.48
TSHR P16473 1/20 0.48
KDM4E B2RXH2 1/20 0.47
MAPT P10636 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
GRIN1 Q05586 1/20 0.47
GRIN2B Q13224 1/20 0.47
EGFR P00533 2/20 0.46
ERBB2 P04626 2/20 0.46
PNP P00491 1/20 0.46
MEN1 O00255 1/20 0.43
CYP1A2 P05177 1/20 0.43
CYP3A4 P08684 1/20 0.43
CYP2D6 P10635 1/20 0.43
CYP2C9 P11712 1/20 0.43
CYP2C19 P33261 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
NPSR1 Q6W5P4 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4359050 0.90 GAA (0.44) GAAKMT2APKMEGFRERBB2
SCHEMBL6753950 0.87 RAB9A (0.59) GAAKMT2AMAPTSMN1; SMN2
SCHEMBL28217562 0.87 GAA (0.60) GAAKMT2APKMTSHRKDM4E
Hydrochloric Acid SCHEMBL28217163 0.85 GAA (0.58) GAAKMT2APKMTSHRKDM4E
SCHEMBL6759193 0.82 GAA (0.54) GAAKMT2APKMTSHRKDM4E
SCHEMBL9540475 0.82 GAA (0.58) GAAKMT2APKMTSHRKDM4E
SCHEMBL8771674 0.82 GAA (0.58) GAAKMT2APKMTSHRKDM4E
SCHEMBL28828753 0.82 GAA (0.58) GAAKMT2APKMTSHRKDM4E
SCHEMBL28839113 0.82 GAA (0.58) GAAKMT2APKMTSHRKDM4E
SCHEMBL27466711 0.81 GAA (0.54) GAAKMT2APKMTSHRKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040171264-A1 Methods of polishing, interconnect-fabrication, and producing semiconductor devices RENESAS TECHNOLOGY CORPORATION 2004-09-02 US disclosed
US-6750128-B2 Methods of polishing, interconnect-fabrication, and producing semiconductor devices RENESAS TECHNOLOGY CORPORATION (JP) 2004-06-15 US disclosed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030186497-A1 Methods of polishing, interconnect-fabrication, and producing semiconductor devices HITACHI, LTD. 2003-10-02 US disclosed
US-6562719-B2 Methods of polishing, interconnect-fabrication, and producing semiconductor devices HITACHI, LTD. (JP) 2003-05-13 US disclosed
US-20020016073-A1 Methods of polishing, interconnect-fabrication, and producing semiconductor devices HITACHI, LTD. 2002-02-07 US disclosed