SCHEMBL654309

SCHEMBL654309

CC1CC2CCC1(C)C2(C)C

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 3/20 0.40
GAA P10253 1/20 0.39
ALDH1A1 P00352 2/20 0.38
MAPT P10636 1/20 0.37
MAPK1 P28482 1/20 0.37
KMT2A Q03164 1/20 0.37
CXCR3 P49682 2/20 0.36
CHRNB2 P17787 4/20 0.36
CHRNB4 P30926 4/20 0.36
CHRNA3 P32297 4/20 0.36
CHRNA7 P36544 4/20 0.36
CHRNA4 P43681 4/20 0.36
CHRNA1 P02708 3/20 0.36
CHRNG P07510 3/20 0.36
CHRNB1 P11230 3/20 0.36
CHRND Q07001 3/20 0.36
LMNA P02545 2/20 0.36
CYP3A4 P08684 1/20 0.36
PKM P14618 1/20 0.36
NFKB1 P19838 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL10543747 0.81 EPHX2 (0.40) EPHX2ALDH1A1MAPTMAPK1KMT2A
SCHEMBL4498337 0.77 ALDH1A1 (0.33) EPHX2GAAALDH1A1MAPTMAPK1
Dexborneol SCHEMBL5031066 0.75 EPHX2 (0.41) EPHX2GAAALDH1A1MAPTMAPK1
Dexborneol SCHEMBL20576252 0.75 EPHX2 (0.41) EPHX2GAAALDH1A1MAPTMAPK1
Dexborneol SCHEMBL3507513 0.75 EPHX2 (0.41) EPHX2GAAALDH1A1MAPTMAPK1
SCHEMBL24853669 0.75 EPHX2 (0.41) EPHX2GAAALDH1A1MAPTMAPK1
Dexborneol SCHEMBL23849409 0.75 EPHX2 (0.41) EPHX2GAAALDH1A1MAPTMAPK1
Borneol SCHEMBL20576251 0.75 EPHX2 (0.41) EPHX2GAAALDH1A1MAPTMAPK1
SCHEMBL247021 0.75 ALDH1A1 (0.39) EPHX2GAAALDH1A1MAPTMAPK1
SCHEMBL542034 0.75 ALDH1A1 (0.39) EPHX2GAAALDH1A1MAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108885396-B Positive working photosensitive material 默克专利有限公司 2023-03-24 CN claimed
US-20220342308-A1 POSITIVE WORKING PHOTOSENSITIVE MATERIALS MERCK PATENT GMBH (DE) 2022-10-27 US claimed
CN-114651212-A Positive photosensitive material 默克专利股份有限公司 2022-06-21 CN claimed
EP-2862024-B1 POSITIVE PHOTOSENSITIVE MATERIAL MERCK PATENT GMBH (DE) 2021-12-01 EP claimed
US-10976662-B2 Positive working photosensitive material MERCK PATENT GMBH (DE) 2021-04-13 US claimed
CN-112654928-A Positive photosensitive material 默克专利股份有限公司 2021-04-13 CN claimed
EP-3446180-B1 POSITIVE WORKING PHOTOSENSITIVE MATERIAL AZ ELECTRONIC MAT LUXEMBOURG SARL (LU) 2020-04-01 EP claimed
EP-2929397-B1 POSITIVE WORKING PHOTOSENSITIVE MATERIAL AZ ELECTRONIC MAT LUXEMBOURG SARL (LU) 2020-03-18 EP claimed
EP-2861638-B1 NEGATIVE-WORKING THICK FILM PHOTORESIST AZ ELECTRONIC MAT LUXEMBOURG SARL (LU) 2018-11-14 EP claimed
US-9012126-B2 Positive photosensitive material AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (LU) 2015-04-21 US claimed
US-8906594-B2 Negative-working thick film photoresist AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (LU) 2014-12-09 US claimed
US-8841062-B2 Positive working photosensitive material AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (LU) 2014-09-23 US claimed
US-20140154624-A1 POSITIVE WORKING PHOTOSENSITIVE MATERIAL AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (US) 2014-06-05 US claimed
US-20130337380-A1 POSITIVE PHOTOSENSITIVE MATERIAL AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (US) 2013-12-19 US claimed
US-20130337381-A1 NEGATIVE-WORKING THICK FILM PHOTORESIST AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (US) 2013-12-19 US claimed
EP-0154339-B1 OPTICAL FIBER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1989-06-07 EP claimed
WO-2024076047-A1 COMPOSITION FOR PLANT DISEASE CONTROL COMPRISING CULTURE FLUID OF STREPTOMYCES LYDICUS JCK-6019 STRAIN OR EXTRACT OF CULTURE FLUID OF STRAIN, PREPARATION METHOD THEREFOR, AND PLANT DISEASE CONTROL METHOD 전남대학교산학협력단 2024-04-11 WO disclosed
CN-111642129-B Imide-terminated prepolymer, preparation method thereof, curable resin composition, application thereof and dual-curing method 浙江迅实科技有限公司 2023-06-23 CN disclosed
US-20020042018-A1 Positive chemically amplified resist and method for forming its pattern NEC CORPORATION 2002-04-11 US disclosed
US-20010026901-A1 (Meth) acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it NEC CORPORATION (JP) 2001-10-04 US disclosed