⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6544566 | 0.90 | — | — | |
| SCHEMBL4512129 | 0.87 | DNM1 (0.50) | — | |
| SCHEMBL4514732 | 0.87 | DNM1 (0.50) | — | |
| SCHEMBL4530381 | 0.87 | DNM1 (0.50) | — | |
| SCHEMBL4525756 | 0.87 | DNM1 (0.50) | — | |
| SCHEMBL14979287 | 0.77 | — | — | |
| SCHEMBL8055855 | 0.73 | — | — | |
| SCHEMBL1897723 | 0.73 | — | — | |
| SCHEMBL25351660 | 0.65 | — | — | |
| SCHEMBL970152 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117219960-A | Separator, method for manufacturing same, and electrochemical element comprising same | SK新技术株式会社 | 2023-12-12 | — | — | CN | disclosed |
| US-11701318-B2 | Process of dyeing keratinous material comprising the use of an organosilicon compound, an effect pigment, and a film-forming polymer I | HENKEL AG & CO. KGAA (DE) | 2023-07-18 | — | — | US | disclosed |
| US-11654095-B2 | Method for dyeing keratinous material, comprising the use of an organosilicon compound, a chromophoric compound, a modified fatty acid ester and a sealing reagent II | HENKEL AG & CO. KGAA (DE) | 2023-05-23 | — | — | US | disclosed |
| US-11564876-B2 | Method for dyeing keratinous material, comprising the use of an organosilicon compound, a silicone polymer and a dyeing compound | HENKEL AG & CO. KGAA (DE) | 2023-01-31 | — | — | US | disclosed |
| US-20220168204-A1 | THE PROCESS OF DYEING KERATINOUS MATERIAL COMPRISING THE USE OF AN ORGANOSILICON COMPOUND, AN EFFECT PIGMENT, AND A FILM-FORMING POLYMER I | HENKEL AG & CO. KGAA (DE) | 2022-06-02 | — | — | US | disclosed |
| US-20210401712-A1 | METHOD FOR TREATING HAIR, COMPRISING THE APPLICATION OF AN ORGANIC SILICON COMPOUND, AN ALKALISING AGENT AND A FILM-FORMING POLYMER | HENKEL AG & CO. KGAA (DE) | 2021-12-30 | — | — | US | disclosed |
| US-20210154121-A1 | METHOD FOR DYEING KERATINOUS MATERIAL, COMPRISING THE USE OF AN ORGANOSILICON COMPOUND, A SILICONE POLYMER AND A DYEING COMPOUND | HENKEL AG & CO. KGAA (DE) | 2021-05-27 | — | — | US | disclosed |
| US-10995268-B2 | Etching composition effective to selectively wet etch a silicon nitride film | LTCAM CO., LTD. (KR) | 2021-05-04 | — | — | US | disclosed |
| CN-110551503-B | Composition for wet etching silicon nitride | LTCAM株式会社 | 2021-04-16 | — | — | CN | disclosed |
| CN-110551503-A | Composition for wet etching silicon nitride | LTCAM CO LTD | 2019-12-10 | — | — | CN | disclosed |
| US-20170110625-A1 | COMPOSITION OF, AND METHOD FOR FORMING, A SEMICONDUCTOR STRUCTURE WITH MULTIPLE INSULATOR COATINGS | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2017-04-20 | — | — | US | disclosed |
| US-20170005226-A1 | Nanocrystalline Quantum Dot Heterostructure | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2017-01-05 | — | — | US | disclosed |
| US-20160341397-A1 | INSULATOR-COATED QUANTUM DOTS FOR USE IN LED LIGHTING AND DISPLAY DEVICES | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2016-11-24 | — | — | US | disclosed |
| US-20160141463-A1 | COMPOSITE HAVING SEMICONDUCTOR STRUCTURES EMBEDDED IN A MATRIX | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2016-05-19 | — | — | US | disclosed |
| US-20140234157-A1 | METHODS FOR FORMING GOLD NANOWIRES ON A SUBSTRATE AND GOLD NANOWIRES FORMED THEREOF | NANYANG TECHNOLOGICAL UNIVERSITY (SG) | 2014-08-21 | — | — | US | disclosed |
| CN-101811027-A | Gas adsorbent and gas adsorption base material | NICCA CHEMICAL CO | 2010-08-25 | — | — | CN | disclosed |
| EP-1082223-B1 | IMAGING AND PRINTING METHODS USING CLAY-CONTAINING FLUID RECEIVING ELEMENT | KODAK POLYCHROME GRAPHICS CO (US) | 2004-01-07 | — | — | EP | disclosed |
| US-6341560-B1 | IMAGEWISE APPLYING FLUID COMPRISING AQUEOUS SOLUTION OF SILANE HAVING TWO OR MORE HYDROXY, ALKOXY OR ACETOXY GROUPS TO FLUID RECEIVING LAYER COMPRISING CLAY, WATER SOLUBLE BINDER AND HARDENING AGENT, ON FLUID RECEIVING ELEMENT | KODAK POLYCHROME GRAPHICS LLC | 2002-01-29 | — | — | US | disclosed |
| EP-1082223-A1 | IMAGING AND PRINTING METHODS USING CLAY-CONTAINING FLUID RECEIVING ELEMENT | Kodak Polychrome Graphics Company Ltd. (US) | 2001-03-14 | — | — | EP | disclosed |
| WO-2000046029-A1 | IMAGING AND PRINTING METHODS USING CLAY-CONTAINING FLUID RECEIVING ELEMENT | KODAK POLYCHROME GRAPHICS COMPANY LTD. (US) | 2000-08-10 | — | — | WO | disclosed |