SCHEMBL6544882

SCHEMBL6544882

Oc1cc(Br)c(-c2c(Br)cc(O)cc2Br)c(Br)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BACE1 P56817 1/20 0.47
ALOX5 P09917 1/20 0.44
PTGS2 P35354 1/20 0.44
ESR1 P03372 3/20 0.41
ESR2 Q92731 3/20 0.41
CYP3A4 P08684 2/20 0.40
TSHR P16473 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
CA1 P00915 3/20 0.36
CA2 P00918 2/20 0.36
CA4 P22748 1/20 0.36
CA6 P23280 1/20 0.36
NQO1 P15559 1/20 0.36
ALOX15 P16050 2/20 0.35
CA9 Q16790 2/20 0.35
ALDH1A1 P00352 1/20 0.35
CA12 O43570 1/20 0.35
GABRA1 P14867 1/20 0.35
GABRB1 P18505 1/20 0.35
GABRA2 P47869 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1899333 0.88 CA1 (0.42) BACE1ALOX5PTGS2ESR1ESR2
SCHEMBL592990 0.79 APEX1 (0.53) BACE1ALOX5PTGS2ESR1ESR2
SCHEMBL69980 0.79 CYP3A4 (0.65) BACE1ALOX5PTGS2CYP3A4TSHR
SCHEMBL28780284 0.78 CYP3A4 (0.42) BACE1ALOX5PTGS2ESR1ESR2
Methane SCHEMBL9716111 0.76 CYP3A4 (0.61) BACE1ALOX5PTGS2CYP3A4TSHR
SCHEMBL11313145 0.73 CA1 (0.45) BACE1ALOX5PTGS2ESR1ESR2
SCHEMBL373421 0.73 ALOX5 (0.46) BACE1ALOX5PTGS2ESR1ESR2
SCHEMBL6802216 0.73 BACE1 (0.41) BACE1ALOX5PTGS2ESR1ESR2
SCHEMBL11310694 0.73 HSD17B10 (0.50) BACE1ALOX5PTGS2ESR1ESR2
SCHEMBL1128268 0.73 GAA (0.58) BACE1ALOX5PTGS2ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1290058-A2 PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2003-03-12 EP claimed
WO-2001088013-A2 PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC (US) 2001-11-22 WO claimed
US-5597876-A CURING AGENT PROVIDES BETTER MECHANICAL PROPERTIES AT HIGH TEMPERATURE SHELL OIL COMPANY (US) 1997-01-28 US claimed
EP-3612582-A1 POLY(PHENYLENE ETHER) COPOLYMER COMPOSITIONS AND ASSOCIATED METHODS AND ARTICLES SABIC Global Technologies B.V. (NL) 2020-02-26 EP disclosed
WO-2018194797-A1 POLY(PHENYLENE ETHER) COPOLYMER COMPOSITIONS AND ASSOCIATED METHODS AND ARTICLES SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-10-25 WO disclosed
WO-2014197834-A1 FLUID LOSS WELL TREATMENT HALLIBURTON ENERGY SERVICES, INC. (US) 2014-12-11 WO disclosed
WO-2014197832-A1 WELL SYSTEM CEMENTING PLUG HALLIBURTON ENERGY SERVICES, INC. (US) 2014-12-11 WO disclosed
EP-1218178-B1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA TEK INC (US) 2004-01-07 EP disclosed
EP-1218178-A4 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA TEK INC (US) 2003-01-08 EP disclosed
EP-1218178-A1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS Ga-Tek Inc. (US) 2002-07-03 EP disclosed
EP-1208159-A1 CYANATE ESTER BASED THERMOSET COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2002-05-29 EP disclosed
US-5597876-A CURING AGENT PROVIDES BETTER MECHANICAL PROPERTIES AT HIGH TEMPERATURE SHELL OIL COMPANY (US) 1997-01-28 US disclosed
EP-0705856-A2 Epoxy resin composition for semiconductor encapsulation SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) 1996-04-10 EP disclosed
EP-0260571-B1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1993-06-30 EP disclosed
US-4895755-A ENCAPSULATION OF ELECTRONIC COMPONENTS THE DOW CHEMICAL COMPANY (US) 1990-01-23 US disclosed
WO-1988002012-A1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-03-24 WO disclosed
US-4727119-A HALOGEN ATOM IN META POSITION WITH RESPECT TO GLYCIDYL ETHER ENCAPSULATION ELECTRICAL COMPONENTS THE DOW CHEMICAL COMPANY (US) 1988-02-23 US disclosed
US-4366171-A Fungicidal biphenyl esters, mixtures thereof and method of use GAF CORPORATION (US) 1982-12-28 US disclosed
US-4252785-A LOW MOLECULAR WEIGHT UREA-FORMALDEHYDE RESIN, GERMICIDE HEXCEL CORPORATION (US) 1981-02-24 US disclosed
US-3956510-A NESTING, CYLINDERS, LOOPS BEALL NELSON J 1976-05-11 US disclosed