SCHEMBL6552184

SCHEMBL6552184

CCCCCC[Si](CC(C)C)(OC)OC

nearest known ligand 0.36

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.36
TSHR P16473 2/20 0.33
THRB P10828 1/20 0.33
DNM1 Q05193 9/20 0.32
EPHX1 P07099 3/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6448123 1.00 LMNA (0.36) LMNATSHRTHRBDNM1EPHX1
SCHEMBL6253371 0.98 LMNA (0.33) LMNA
SCHEMBL6449178 0.91 LMNA (0.31) LMNA
Hexane SCHEMBL28388046 0.87 OPRM1 (0.33) LMNATSHRTHRB
SCHEMBL6451615 0.82
SCHEMBL3229707 0.82 TSHR (0.44) LMNATSHRTHRBDNM1EPHX1
SCHEMBL8978805 0.82 TSHR (0.44) LMNATSHRTHRBDNM1EPHX1
SCHEMBL10701293 0.82 TSHR (0.44) LMNATSHRTHRBDNM1EPHX1
SCHEMBL3238210 0.82 TSHR (0.44) LMNATSHRTHRBDNM1EPHX1
SCHEMBL8978827 0.82 TSHR (0.44) LMNATSHRTHRBDNM1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1162213-B1 PROPYLENE COPOLYMER AND MOLDED OBJECT OBTAINED BY MOLDING THE COPOLYMER IDEMITSU PETROCHEMICAL CO (JP) 2004-02-11 EP disclosed
US-6639038-B2 Rigid, heat resistance, good scratch resistance; specified amount of soluble component of polypropylene, differential scanning calorimetry melting point, and peak in gel permeation chromatography molecular weight distribution curve IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-10-28 US disclosed
US-6552136-B1 To produce polymer having stereospecificity and increased melt fluidity IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-04-22 US disclosed
US-6455659-B1 HIGHLY RIGID; THIN AND LIGHTWEIGHT MOLDINGS; HEAT RESISTANCE AND SCRATCH RESISTANCE; SPECIFIED PHYSICAL PROPERTIES IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2002-09-24 US disclosed
US-6423782-B1 ETHYLENE-PROPYLENE COPOLYMER; RADIATION TRANSPARENT, IMPACT STRENGTH, FLEXIBILITY IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2002-07-23 US disclosed
US-20020028898-A1 Crystalline polypropylene and its moldings and films IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2002-03-07 US disclosed
EP-1162213-A1 PROPYLENE COPOLYMER AND MOLDED OBJECT OBTAINED BY MOLDING THE COPOLYMER IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2001-12-12 EP disclosed
US-6287705-B1 ETHYLENE-PROPYLENE COPOLYMER; MULTILAYER FILM IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2001-09-11 US disclosed
US-6270911-B1 HEAT-SEALABILITY, MOLDABILITY; FOR BAGS IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2001-08-07 US disclosed