SCHEMBL6562433

SCHEMBL6562433

CCCO[Si](C#Cc1ccccc1)(C#Cc1ccccc1)OCCC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.39
CHRNB2 P17787 1/20 0.38
CHRNB4 P30926 1/20 0.38
CHRNA3 P32297 1/20 0.38
CHRNA7 P36544 1/20 0.38
CHRNA4 P43681 1/20 0.38
NPC1 O15118 3/20 0.37
RAB9A P51151 3/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
CYP1A2 P05177 2/20 0.37
CYP3A4 P08684 2/20 0.37
CYP2C9 P11712 2/20 0.37
CYP2C19 P33261 2/20 0.37
THPO P40225 2/20 0.37
GRM5 P41594 2/20 0.37
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
NPSR1 Q6W5P4 1/20 0.37
KDM4E B2RXH2 1/20 0.37
ALDH1A1 P00352 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562553 0.89 LTA4H (0.44) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6564403 0.87 APP (0.41) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6564478 0.85 APP (0.39) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6561451 0.85 APP (0.42) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6563027 0.84 APP (0.38) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6562702 0.76 LTA4H (0.46) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6564093 0.76 HTR2A (0.41) APPNPC1RAB9ASMN1; SMN2CYP1A2
SCHEMBL6562783 0.75 LTA4H (0.44) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6562877 0.75 APP (0.44) APPCHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL6562555 0.74 APP (0.48) APPNPC1RAB9ASMN1; SMN2CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed