⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12228801 | 0.73 | — | — | |
| SCHEMBL3951254 | 0.71 | — | — | |
| SCHEMBL3221729 | 0.69 | — | — | |
| SCHEMBL29207346 | 0.67 | — | — | |
| SCHEMBL5613573 | 0.66 | ALDH1A1 (0.33) | — | |
| SCHEMBL29207349 | 0.63 | — | — | |
| SCHEMBL8846733 | 0.60 | — | — | |
| SCHEMBL6562639 | 0.59 | — | — | |
| SCHEMBL705855 | 0.58 | — | — | |
| SCHEMBL7039492 | 0.56 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4656667-A1 | CURABLE COMPOSITION | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-03 | — | — | EP | disclosed |
| US-20250289954-A1 | HEAT-CURABLE PERFLUOROPOLYETHER RUBBER COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-18 | — | — | US | disclosed |
| EP-4516858-A1 | HEAT-CURABLE PERFLUOROPOLYETHER RUBBER COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-03-05 | — | — | EP | disclosed |
| CN-119095913-A | Thermosetting perfluoropolyether rubber composition | 信越化学工业株式会社 | 2024-12-06 | — | — | CN | disclosed |
| WO-2024147260-A1 | PERFLUOROPOLYETHER POLYMER-CONTAINING CURABLE COMPOSITION AND ARTICLE | 信越化学工業株式会社 | 2024-07-11 | — | — | WO | disclosed |
| CN-117148676-A | Negative photoresist composition for organic insulating film of liquid crystal display element | 烟台希尔德材料科技有限公司 | 2023-12-01 | — | — | CN | disclosed |
| EP-3103842-B1 | CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW TORAY CO LTD (JP) | 2023-01-11 | — | — | EP | disclosed |
| CN-110088207-B | Curable silicone composition and optical semiconductor device using the same | 陶氏东丽株式会社 | 2022-10-14 | — | — | CN | disclosed |
| EP-3039079-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DDP SPECIALTY ELECTRONIC MAT US 9 LLC (US) | 2022-05-18 | — | — | EP | disclosed |
| CN-110662805-B | Silicone resin composition, adhesive using same, display device, semiconductor device, and lighting device | 东丽株式会社 | 2022-02-08 | — | — | CN | disclosed |
| WO-2015030224-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING CORPORATION (US) | 2015-03-05 | — | — | WO | disclosed |
| CN-102566278-B | Siloxane polymer composition, cured film and method for forming the cured film | JSR CORP | 2015-01-21 | — | — | CN | disclosed |
| WO-2014065432-A1 | ORGANOPOLYSILOXANE, CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD. (JP) | 2014-05-01 | — | — | WO | disclosed |
| US-20140014928-A1 | ORGANIC EL ELEMENT, RADIATION-SENSITIVE RESIN COMPOSITION, AND CURED FILM | JSR CORPORATION (JP) | 2014-01-16 | — | — | US | disclosed |
| EP-1122746-B1 | Composition for film formation and insulating film | JSR CORP (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-6468589-B2 | A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING | JSR CORPORATION (JP) | 2002-10-22 | — | — | US | disclosed |
| US-20010012870-A1 | Composition for film formation and insulating film | JSR CORPORATION (JP) | 2001-08-09 | — | — | US | disclosed |
| EP-1122746-A1 | Composition for film formation and insulating film | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| US-5252685-A | RTV organopolysiloxane compositions for use as cork chip binders and bonded cork chip articles | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1993-10-12 | — | — | US | disclosed |
| US-4398010-A | CONTAINING PLATINUM | SWS SILICONES CORPORATION (US) | 1983-08-09 | — | — | US | disclosed |