SCHEMBL6564428

SCHEMBL6564428

Cc1cc(Oc2ccc(Cl)c(C)c2)ccc1Cl

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.56
POLB P06746 1/20 0.56
KMT2A Q03164 4/20 0.54
MEN1 O00255 3/20 0.54
MCL1 Q07820 1/20 0.53
HTR2A P28223 2/20 0.51
SLC6A4 P31645 2/20 0.51
KCNH2 Q12809 2/20 0.51
ALDH1A1 P00352 2/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
HSP90AA1 P07900 1/20 0.47
PKM P14618 1/20 0.46
NPC1 O15118 2/20 0.44
RAB9A P51151 1/20 0.44
TP53 P04637 1/20 0.44
GAA P10253 1/20 0.44
MRGPRX4 Q96LA9 1/20 0.41
HTT P42858 1/20 0.41
ICAM1 P05362 1/20 0.41
SELE P16581 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10599282 0.91 HTR2A (0.54) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL11543548 0.89 ALDH1A1 (0.54) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL11184060 0.89 KDM4E (0.49) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL11179365 0.88 KMT2A (0.54) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL20565449 0.88 KMT2A (0.57) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL554765 0.88 POLB (0.64) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL12260887 0.88 KDM4E (0.47) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL17050946 0.86 KDM4E (0.46) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL257824 0.86 KDM4E (0.46) KDM4EPOLBKMT2AMEN1MCL1
SCHEMBL9321774 0.86 SLC6A4 (0.50) KDM4EPOLBKMT2AMEN1MCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed
EP-0297353-A2 Moulding compositions from polycarbonate, thermotropic polymer, graft polymer and fluorinated polyolefin BAYER AG (DE) 1989-01-04 EP disclosed