SCHEMBL65664

SCHEMBL65664

COc1ccccn1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15561907 1.00 KDM4E (0.50)
SCHEMBL29531218 1.00
Hydrochloric Acid SCHEMBL29077445 0.97
SCHEMBL30065146 0.97
SCHEMBL28091796 0.97
Hydrochloric Acid SCHEMBL10488706 0.97 KDM4E (0.48)
Bromide SCHEMBL34472696 0.97 KDM4E (0.48)
Hydrochloric Acid SCHEMBL7736230 0.97 KDM4E (0.48)
Hydrochloric Acid SCHEMBL8914539 0.97
Bromide SCHEMBL28197991 0.97

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 7725 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260132126-A1 IMIDAZOLE DERIVATIVES SANWA KAGAKU KENKYUSHO CO., LTD. (JP) 2026-05-14 US claimed
US-12486260-B2 Indazolyl-isoxazole derivatives for the treatment of diseases such as cancer MERCK PATENT GMBH (DE) 2025-12-02 US claimed
US-20250361244-A1 BICYCLIC HETEROCYCLYL DERIVATIVES AS IRAK4 INHIBITORS AURIGENE ONCOLOGY LTD (IN) 2025-11-27 US claimed
EP-4607278-A1 CHEMICALLY-AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR PATTERN PROFILE IMPROVEMENT AND ETCH RESISTANCE ENHANCEMENT Ycchem Co., Ltd. (KR) 2025-08-27 EP claimed
EP-4603489-A1 IMIDAZOLE DERIVATIVE SANWA KAGAKU KENKYUSHO CO., LTD. (JP) 2025-08-20 EP claimed
US-20250199405-A1 CHEMICALLY-AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR PATTERN PROFILE IMPROVEMENT AND ETCH RESISTANCE ENHANCEMENT YCCHEM CO., LTD. (KR) 2025-06-19 US claimed
US-12331239-B2 Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt BASF SE (DE) 2025-06-17 US claimed
CN-119998277-A Imidazole derivatives 株式会社三和化学研究所 2025-05-13 CN claimed
CN-119998727-A Chemically amplified positive resist composition for improving pattern profile and enhancing etch resistance YC化学制品株式会社 2025-05-13 CN claimed
CN-119707785-A Bipyridine-based multifunctional ionic liquid and preparation method and application thereof 湖南师范大学 2025-03-28 CN claimed
CN-1004488-B Self-curing urethane bond paste system 雅士兰石油公司 1989-06-14 CN claimed
CN-86104759-A The ethyl carbamate binding paste system of self cure 1987-05-13 CN claimed
CN-85109303-A The 2-phenylpyran is the preparation method of [2,3-b] pyridine compounds and their also 1986-08-20 CN claimed
EP-0097620-B1 HEAT OR PRESSURE SENSITIVE REGISTRATION MATERIAL CIBA-GEIGY AG (CH) 1986-07-30 EP claimed
EP-0178633-A2 2-phenylpyrano[2,3-b]pyridines MERRELL DOW PHARMACEUTICALS INC. (US) 1986-04-23 EP claimed
US-4513302-A Pressure-sensitive or heat-sensitive recording material CIBA-GEIGY CORPORATION (US) 1985-04-23 US claimed
EP-0097620-A2 Heat or pressure sensitive registration material CIBA-GEIGY AG (CH) 1984-01-04 EP claimed
US-4138553-A 3-Methylene cephalosporanic acid derivatives and process for preparation thereof TEIJIN LIMITED (JP) 1979-02-06 US claimed
US-4045535-A MIXING MOLD; CURING RESMENT INC. (US) 1977-08-30 US claimed
US-3980664-A ANTIMICROBIAL; 2-METHOXYPYRIDINE WITH BROMOMETHYL-5-NITRO-2-FURYL KETONE MORTON-NORWICH PRODUCTS, INC. (US) 1976-09-14 US claimed