Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 3/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | FGFR4 | P22455 | 1/20 | 0.32 |
| ▸ | TGM2 | P21980 | 1/20 | 0.31 |
| ▸ | ZDHHC20 | Q5W0Z9 | 1/20 | 0.31 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL8941491 | 0.98 | ALDH1A1 (0.40) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL421304 | 0.81 | — | — | |
| SCHEMBL3315750 | 0.81 | ALDH1A1 (0.43) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL8079781 | 0.77 | ALDH1A1 (0.41) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL29663963 | 0.76 | ALDH1A1 (0.43) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL27685216 | 0.76 | ALDH1A1 (0.40) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL7101115 | 0.75 | ALDH1A1 (0.46) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL26705 | 0.75 | — | — | |
| SCHEMBL6574629 | 0.75 | ALDH1A1 (0.40) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR | |
| SCHEMBL8772020 | 0.74 | ALDH1A1 (0.42) | ALDH1A1CYP3A4CYP2C9CYP2C19TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105264647-B | Silicon Wafer composition for polishing | 福吉米株式会社 | 2018-01-09 | — | — | CN | disclosed |
| CN-105264647-A | Composition for silicon wafer polishing | FUJIMI INC | 2016-01-20 | — | — | CN | disclosed |
| CN-105073941-A | Polishing composition and method for manufacturing polished article | FUJIMI INC | 2015-11-18 | — | — | CN | disclosed |
| CN-104995277-A | POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION, AND PRODUCTION METHOD FOR POLISHED ARTICLE | FUJIMI INC | 2015-10-21 | — | — | CN | disclosed |
| EP-1409557-A1 | NOVEL HEAT-THICKENING POLYMERS, PREPARATION METHOD, POSITIVE MICROLATEX AND POSITIVE LATEX CONTAINING SAME AND USE THEREOF AS HEAT-THICKENING AGENT | SOCIETE D'EXPLOITATION DE PRODUITS POUR LES INDUSTRIES CHIMIQUES-SEPPIC (FR) | 2004-04-21 | — | — | EP | disclosed |
| WO-2003008462-A1 | NOVEL HEAT-THICKENING POLYMERS, PREPARATION METHOD, POSITIVE MICROLATEX AND POSITIVE LATEX CONTAINING SAME AND USE THEREOF AS HEAT-THICKENING AGENT | SOCIETE D'EXPLOITATION DE PRODUITS POUR LES INDUSTRIES CHIMIQUES (S.E.P.P.I.C.) (FR) | 2003-01-30 | — | — | WO | disclosed |