Propane

Propane

SCHEMBL6578175

CCC.N=C=S

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propane SCHEMBL21332501 1.00
Benzene SCHEMBL11701083 0.88 MIF (0.31)
Butane SCHEMBL4079937 0.86
Butane SCHEMBL4079939 0.86 NAAA (0.30)
Isothiocyanate SCHEMBL11120176 0.82
Alcohol SCHEMBL29171811 0.82
Pentane SCHEMBL17289581 0.79 TSHR (0.54)
Hexane SCHEMBL28393830 0.79 TSHR (0.50)
Hexane SCHEMBL21496135 0.79
Pentane SCHEMBL28059519 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119630658-A Heterocyclic RBM39 modulators 递归医药公司 2025-03-14 CN disclosed
CN-113929866-B Modified resin and resin composition 旭化成株式会社 2023-07-07 CN disclosed
CN-111205424-B Modified resin and resin composition 旭化成株式会社 2022-04-08 CN disclosed
CN-113929866-A Modified resin and resin composition 旭化成株式会社 2022-01-14 CN disclosed
CN-107629183-B Modified resin and resin composition 旭化成株式会社 2021-01-05 CN disclosed
CN-111205424-A Modified resin and resin composition 旭化成株式会社 2020-05-29 CN disclosed
CN-105358602-B modified resin and resin composition 旭化成株式会社 2018-12-04 CN disclosed
CN-107629183-A Modified resin and resin combination 旭化成株式会社 2018-01-26 CN disclosed
CN-105358602-A Modified resin and resin composition ASAHI KASEI CHEMICALS CORP 2016-02-24 CN disclosed
EP-1120435-B1 APPARATUS AND METHOD FOR PRODUCING RESIN TEIJIN LTD (JP) 2004-05-06 EP disclosed
US-6562936-B1 Resin excellent in hydrolysis and heat stability such as a reduction in molecular weight at the time of molding and color retention and moldability such as releasability and transferability, rarely experiences residence deterioration TEIJIN LIMITED (JP) 2003-05-13 US disclosed
US-6509435-B1 Heat resistance, stability; moldings TEIJIN LIMITED (JP) 2003-01-21 US disclosed
EP-1191049-A1 POLYCARBONATE, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2002-03-27 EP disclosed
EP-1120435-A1 APPARATUS AND METHOD FOR PRODUCING RESIN TEIJIN LIMITED (JP) 2001-08-01 EP disclosed