SCHEMBL66058

SCHEMBL66058

CCO[Si](C)(CC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL27489244 0.97
Phosphine SCHEMBL27930491 0.97
Methylamine SCHEMBL2763445 0.94
SCHEMBL27722386 0.86
SCHEMBL1609056 0.86
SCHEMBL19809166 0.84
SCHEMBL27710220 0.84
SCHEMBL332696 0.79
SCHEMBL135560 0.79
SCHEMBL14366859 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1298 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117844445-B Organic silicon liquid adhesive for LED and preparation method thereof 江苏诚睿达光电有限公司 2025-05-09 CN claimed
CN-119306505-A Carbon ceramic material, carbon ceramic brake disc and preparation method of carbon ceramic brake disc 比亚迪股份有限公司 2025-01-14 CN claimed
CN-119081123-A Hydroxy silica gel and preparation method thereof 湖北兴瑞硅材料有限公司 2024-12-06 CN claimed
CN-118930797-A Aqueous polyurethane dispersion and preparation method and application thereof 松井(上海)新材料研究院有限公司 2024-11-12 CN claimed
CN-118421258-A Organic silicon pouring sealant and preparation method and application thereof 广州集泰化工股份有限公司 2024-08-02 CN claimed
CN-117995660-A Method and system for adjusting properties of photoresist adhesion layer ASM IP私人控股有限公司 2024-05-07 CN claimed
CN-117844445-A Organic silicon liquid adhesive for LED and preparation method thereof 江苏诚睿达光电有限公司 2024-04-09 CN claimed
CN-117720729-A Preparation method of organosilicon auxiliary agent with high hydroxyl value and low ring body content 江西蓝星星火有机硅有限公司 2024-03-19 CN claimed
CN-116949433-A Method and system for forming silicon oxycarbide layer and structure formed using the same ASM IP私人控股有限公司 2023-10-27 CN claimed
CN-116836681-A High-adhesion organic silicon die bond adhesive for LED 江苏诚睿达光电有限公司 2023-10-03 CN claimed
US-8247516-B2 Room-temperature curable organopolysiloxane composition DOW CORNING TORAY COMPANY, LTD. (JP) 2012-08-21 US claimed
CN-101792633-A Preparation method for antistatic super hydrophobic composite coating UNIV ZHEJIANG 2010-08-04 CN claimed
CN-100464976-C High temperature resistant resin board and its preparation method JIAN LI (CN) 2009-03-04 CN claimed
US-20080265381-A1 SiCOH DIELECTRIC INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-10-30 US claimed
US-20070173071-A1 SiCOH dielectric INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-07-26 US claimed
CN-1834099-A Bisilane coupler contg. sulfur and its prepn. UNIV ZHEJIANG (CN) 2006-09-20 CN claimed
CN-1590079-A High temperature resistant resin board and its preparation method LI JIAN (CN) 2005-03-09 CN claimed
EP-0477805-B1 Water repellent surface treatment PPG INDUSTRIES INC (US) 1995-11-15 EP claimed
CN-1088231-A Size composition OWENS CORNING FIBERGLASS CORP (US) 1994-06-22 CN claimed
EP-0083402-A1 Coordination complexes as polyesterification catalysts UNION CARBIDE CORPORATION (US) 1983-07-13 EP claimed