SCHEMBL664919

SCHEMBL664919

O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].[Hf+4].[Zr+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15518525 0.94
SCHEMBL49558 0.94
SCHEMBL42699 0.94
SCHEMBL1367445 0.88
SCHEMBL4006109 0.88
SCHEMBL1395928 0.88
SCHEMBL6233000 0.88
SCHEMBL2003291 0.88
SCHEMBL409529 0.88
SCHEMBL4130970 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025029358-A1 MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCKING DIELECTRIC AND TUNGSTEN NITRIDE BARRIER AND METHODS OF FORMING THE SAME SanDisk Technologies, Inc. (US) 2025-02-06 WO claimed
US-20250048641-A1 MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCKING DIELECTRIC AND TUNGSTEN NITRIDE BARRIER AND METHODS OF FORMING THE SAME SanDisk Technologies, Inc. 2025-02-06 US claimed
US-20220376176-A1 METHODS OF FORMING ELECTRONIC DEVICES COMPRISING METAL OXIDE MATERIALS MICRON TECHNOLOGY INC (US) 2022-11-24 US claimed
US-11444243-B2 Electronic devices comprising metal oxide materials and related methods and systems MICRON TECHNOLOGY, INC. (US) 2022-09-13 US claimed
EP-4052297-A1 ELECTRONIC DEVICES COMPRISING METAL OXIDE MATERIALS AND RELATED METHODS AND SYSTEMS Micron Technology, Inc. (US) 2022-09-07 EP claimed
CN-114631198-A Electronic devices including metal oxide materials and related methods and systems 美光科技公司 2022-06-14 CN claimed
US-20210126193-A1 ELECTRONIC DEVICES COMPRISING METAL OXIDE MATERIALS AND RELATED METHODS AND SYSTEMS MICRON TECHNOLOGY, INC. 2021-04-29 US claimed
US-20170069711-A1 CAPACITOR AND A SEMICONDUCTOR DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD (KR) 2017-03-09 US claimed
US-9577028-B2 Semiconductor device including a capacitor SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-02-21 US claimed
US-20160358998-A1 SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR SAMSUNG ELECTRONICS CO., LTD (KR) 2016-12-08 US claimed
US-20110065287-A1 PULSED CHEMICAL VAPOR DEPOSITION OF METAL-SILICON-CONTAINING FILMS TOKYO ELECTRON LIMITED (JP) 2011-03-17 US claimed
WO-2011031591-A1 PULSED CHEMICAL VAPOR DEPOSITION OF METAL-SILICON-CONTAINING FILMS TOKYO ELECTRON LIMITED (JP) 2011-03-17 WO claimed
US-20100261342-A1 SEMICONDUCTOR DEVICE CONTAINING A BURIED THRESHOLD VOLTAGE ADJUSTMENT LAYER AND METHOD OF FORMING TOKYO ELECTRON LIMITED (JP) 2010-10-14 US claimed
US-20100248464-A1 METHOD FOR FORMING A HIGH-k GATE STACK WITH REDUCED EFFECTIVE OXIDE THICKNESS TOKYO ELECTRON LIMITED (JP) 2010-09-30 US claimed
WO-2010111453-A1 METHOD FOR FORMING A HIGH-K GATE STACK WITH REDUCED EFFECTIVE OXIDE THICKNESS TOKYO ELECTRON LIMITED (JP) 2010-09-30 WO claimed
US-7652341-B2 Semiconductor apparatus having a semicondutor element with a high dielectric constant film KABUSHIKI KAISHA TOSHIBA (JP) 2010-01-26 US claimed
US-20090085175-A1 SEMICONDUCTOR DEVICE CONTAINING A BURIED THRESHOLD VOLTAGE ADJUSTMENT LAYER AND METHOD OF FORMING TOKYO ELECTRON LIMITED (JP) 2009-04-02 US claimed
EP-1532290-B1 SYSTEMS AND METHODS FOR FORMING ZIRCONIUM AND/OR HAFNIUM-CONTAINING LAYERS MICRON TECHNOLOGY INC (US) 2008-12-24 EP claimed
US-20080054378-A1 Semiconductor apparatus and method of manufacturing the semiconductor apparatus KABUSHIKI KAISHA TOSHIBA 2008-03-06 US claimed
US-7265427-B2 Semiconductor apparatus and method of manufacturing the semiconductor apparatus KABUSHIKI KAISHA TOSHIBA (JP) 2007-09-04 US claimed