SCHEMBL6656705

SCHEMBL6656705

CCCCCCCCCC(OCCCC)(OCCCC)OC(=O)CCCCC(=O)OC(CCCCCCCCC)(OCCCC)OCCCC

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.50
LMNA P02545 3/20 0.43
DNM1 Q05193 1/20 0.42
PAM P19021 2/20 0.42
MAPT P10636 2/20 0.41
MAPK1 P28482 1/20 0.41
TSHR P16473 3/20 0.40
CES2 O00748 3/20 0.39
CES1 P23141 3/20 0.39
ALDH1A1 P00352 2/20 0.39
NAAA Q02083 1/20 0.39
PPARG P37231 3/20 0.38
PPARD Q03181 3/20 0.38
PPARA Q07869 3/20 0.38
GPR84 Q9NQS5 2/20 0.38
HDAC11 Q96DB2 2/20 0.38
TDP1 Q9NUW8 2/20 0.38
SLC22A6 Q4U2R8 1/20 0.38
SLC22A8 Q8TCC7 1/20 0.38
TLR2 O60603 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6656707 0.94 GPR84 (0.50) DGKALMNAPAMMAPTTSHR
SCHEMBL17812785 0.88 DGKA (0.47) DGKALMNADNM1PAMMAPT
SCHEMBL10614206 0.84 DGKA (0.46) DGKALMNADNM1PAMMAPT
SCHEMBL28638252 0.84 AKR1B1 (0.46) DGKAPAMMAPTTSHRALDH1A1
SCHEMBL17812786 0.83 GPR84 (0.52) LMNAPAMMAPTTSHRALDH1A1
SCHEMBL29421613 0.81 GPR84 (0.59) LMNAPAMMAPTTSHRALDH1A1
SCHEMBL28701864 0.81 DGKA (0.61) DGKALMNADNM1PAMMAPT
SCHEMBL3673402 0.81 DGKA (0.43) DGKALMNADNM1PAMMAPT
SCHEMBL3669923 0.81 DGKA (0.43) DGKALMNADNM1PAMMAPT
SCHEMBL9956013 0.80 DGKA (0.53) DGKALMNAPAMMAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0878527-B1 Peelable heat-conductive and pressuresensitive adhesive and adhesive sheet containing the same NITTO DENKO CORP (JP) 2004-07-28 EP disclosed
US-6207272-B1 AN ADHESIVE SHEET COMPRISING A SUBSTRATE AND, FORMED ON ONE OR EACH SIDE OF SUBSTRATE, A LAYER OF THE ADHESIVE, COMPRISING A COPOLYMER OF ALKYL METH(ACRYLATE) AND 0-30% MONOETHYLENIC MONOMER, A PLASTICIZER AND A FILLER NITTO DENKO CORPORATION (JP) 2001-03-27 US disclosed
EP-0878527-A1 Peelable heat-conductive and pressuresensitive adhesive and adhesive sheet containing the same NITTO DENKO CORPORATION (JP) 1998-11-18 EP disclosed