SCHEMBL6657261

SCHEMBL6657261

Oc1ccc(C(c2ccccc2O)c2ccccc2O)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 4/20 0.53
ALDH1A1 P00352 2/20 0.53
KMT2A Q03164 2/20 0.53
GAA P10253 1/20 0.53
GABRA1 P14867 1/20 0.48
GABRB2 P47870 1/20 0.48
TSHR P16473 1/20 0.43
PTPN2 P17706 1/20 0.43
PTPN1 P18031 1/20 0.43
ESR1 P03372 5/20 0.41
ESR2 Q92731 4/20 0.41
PDCD1 Q15116 1/20 0.41
CD274 Q9NZQ7 1/20 0.41
IDO1 P14902 1/20 0.39
TDO2 P48775 1/20 0.39
CA12 O43570 2/20 0.39
CA2 P00918 2/20 0.39
CA3 P07451 2/20 0.39
CA4 P22748 2/20 0.39
CA14 Q9ULX7 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2863812 0.95 TDP1 (0.58) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL31375412 0.93 GABRA1 (0.54) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL1758215 0.93 GABRA1 (0.54) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL51106 0.86 GABRA1 (0.52) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL1758062 0.83 TDP1 (0.64) TDP1ALDH1A1KMT2AGAATSHR
SCHEMBL11054474 0.83 KMT2A (0.44) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL16151181 0.83 GABRA1 (0.61) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL19813862 0.83 GABRA1 (0.50) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL8835184 0.82 GABRA1 (0.48) TDP1ALDH1A1KMT2AGAAGABRA1
SCHEMBL982045 0.81 GABRA1 (0.52) TDP1ALDH1A1KMT2AGAAGABRA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239947-A1 THERMOSETTING COMPOSITION, POLYURETHANE RESIN COMPOSITION AND POLYURETHANE MOLDED BODY IDEMITSU KOSAN CO.,LTD. (JP) 2024-07-18 US disclosed
US-20240239947-A1 THERMOSETTING COMPOSITION, POLYURETHANE RESIN COMPOSITION AND POLYURETHANE MOLDED BODY IDEMITSU KOSAN CO.,LTD. (JP) 2024-07-18 US disclosed
EP-4269504-A1 LIGNIN COMPOSITION AND USE THEREOF Idemitsu Kosan Co., Ltd (JP) 2023-11-01 EP disclosed
JP-2004323718-A EPOXY RESIN COMPOSITION AND ITS USE MITSUI CHEMICALS INC 2004-11-18 JP disclosed
US-5401605-A Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound TOKYO OHKA KOGYO CO., LTD. (JP) 1995-03-28 US disclosed
EP-0554101-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-08-04 EP disclosed