SCHEMBL6661184

SCHEMBL6661184

CC12C=CC(C1)C1C(=O)OC(=O)C12.CC1CCCC2=C1C(=O)OC2=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL541892 0.79 KDM4E (0.31)
SCHEMBL18145166 0.79 KDM4E (0.31)
Phthalic Anhydride SCHEMBL18393933 0.75 ALOX15 (0.38)
SCHEMBL253698 0.74 CA1 (0.43)
SCHEMBL6661182 0.72 TDP1 (0.31)
SCHEMBL8619667 0.65 CA1 (0.37)
SCHEMBL7195582 0.63
SCHEMBL31229891 0.61 KDM4E (0.30)
SCHEMBL7189844 0.60 KDM4E (0.31)
SCHEMBL9144551 0.60 KDM4E (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1299447-B1 NO-FLOW FLUX ADHESIVE COMPOSITIONS 3M INNOVATIVE PROPERTIES CO (US) 2004-08-25 EP disclosed
EP-1299447-A2 NO-FLOW FLUX ADHESIVE COMPOSITIONS 3M Innovative Properties Company (US) 2003-04-09 EP disclosed
US-6528169-B2 One-part, thermally-curable adhesive composition comprising: an epoxy resin substantially free of hydroxyl functionality; and an anhydride curing agent. 3M INNOVATIVE PROPERTIES COMPANY 2003-03-04 US disclosed
US-20020032280-A1 No-flow flux adhesive compositions 3M INNOVATIVE PROPERTIES COMPANY 2002-03-14 US disclosed
WO-2002004541-A2 NO-FLOW FLUX ADHESIVE COMPOSITIONS 3M INNOVATIVE PROPERTIES COMPANY (US) 2002-01-17 WO disclosed