Biphenyl

Biphenyl

SCHEMBL6676504

C=CC(=O)OOOC(=O)C=C.c1ccc(-c2ccccc2)cc1

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.44
AKT1 P31749 1/20 0.43
TGM2 P21980 2/20 0.39
EGFR P00533 1/20 0.39
TP53 P04637 1/20 0.38
ALDH1A1 P00352 3/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
MAPT P10636 2/20 0.38
CYP3A4 P08684 1/20 0.37
LMNA P02545 3/20 0.37
F2 P00734 1/20 0.37
MAPK1 P28482 1/20 0.37
TSHR P16473 2/20 0.36
ABCC4 O15439 1/20 0.36
GAA P10253 1/20 0.36
PTGS1 P23219 1/20 0.36
HTT P42858 1/20 0.36
KMO O15229 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL17685702 0.86 CA12 (0.44) THRBAKT1TGM2MAPTCYP3A4
Phenol SCHEMBL2227325 0.86 CA12 (0.44) THRBAKT1TGM2MAPTCYP3A4
Phenol SCHEMBL1415095 0.84 CA12 (0.42) THRBAKT1TGM2MAPTCYP3A4
Phthalic Acid SCHEMBL8629198 0.84 ALDH1A1 (0.54) THRBAKT1ALDH1A1SMN1; SMN2MAPT
Benzaldehyde SCHEMBL8590424 0.82 ALDH1A1 (0.52) THRBAKT1TGM2ALDH1A1SMN1; SMN2
Biphenyl SCHEMBL19019808 0.81 THRB (0.46) THRBAKT1TGM2EGFRTP53
SCHEMBL16259032 0.80 THRB (0.50) THRBAKT1TGM2EGFRTP53
Biphenyl SCHEMBL28288581 0.80 THRB (0.42) THRBAKT1ALDH1A1SMN1; SMN2MAPT
Biphenyl SCHEMBL5899505 0.79 MAPT (0.45) THRBAKT1TGM2EGFRALDH1A1
SCHEMBL26479 0.79 TSHR (0.42) THRBTP53ALDH1A1SMN1; SMN2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117843507-A Chalcone photoinitiator capable of self-supplying hydrogen and application of chalcone photoinitiator in preparation of white photosensitive ink 合肥工业大学 2024-04-09 CN claimed
CN-113652118-A UV jet printing ink with high adhesive force and good bending property 艾森半导体材料(南通)有限公司 2021-11-16 CN claimed
CN-107722713-B Double-component liquid photosensitive white solder resist ink for PCB and preparation method thereof 广东高仕电研科技有限公司 2020-11-13 CN claimed
CN-107674491-B A kind of white photosensitive solder resist ink and preparation method thereof 广东高仕电研科技有限公司 2018-08-28 CN claimed
CN-107722713-A Two-component liquid photosensitive white solder mask for PCB and preparation method thereof 广东高仕电研科技有限公司 2018-02-23 CN claimed
CN-107674491-A A kind of white photosensitive solder resist ink and preparation method thereof 广东高仕电研科技有限公司 2018-02-09 CN claimed
US-20160243817-A1 COMPOSITION FOR INSULATION-COATING SHIELD CAN AND METHOD FOR INSULATION-COATING SHIELD CAN BY USING SAME ROH JAEHO (KR) 2016-08-25 US claimed
EP-1076262-B1 Photosensitive resin MITSUBISHI GAS CHEMICAL CO (JP) 2004-10-20 EP claimed
US-6524769-B1 Heat resistance and reliability on electric insulation under moisture; printed circuit; difunctional epoxy acrylate with biphenyl skeleton with a cyanate ester compound and a polybasic acid anhydride MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2003-02-25 US claimed
EP-1076262-A1 Photosensitive resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-02-14 EP claimed
CN-117843507-A Chalcone photoinitiator capable of self-supplying hydrogen and application of chalcone photoinitiator in preparation of white photosensitive ink 合肥工业大学 2024-04-09 CN disclosed
CN-115128903-A Photosensitive resin composition 味之素株式会社 2022-09-30 CN disclosed
CN-114839838-A Photosensitive resin composition 味之素株式会社 2022-08-02 CN disclosed
CN-114114836-A Photosensitive resin composition 味之素株式会社 2022-03-01 CN disclosed
CN-113946101-A Photosensitive resin composition 味之素株式会社 2022-01-18 CN disclosed
EP-1076262-B1 Photosensitive resin MITSUBISHI GAS CHEMICAL CO (JP) 2004-10-20 EP disclosed
US-6524769-B1 Heat resistance and reliability on electric insulation under moisture; printed circuit; difunctional epoxy acrylate with biphenyl skeleton with a cyanate ester compound and a polybasic acid anhydride MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2003-02-25 US disclosed
US-6524769-B1 Heat resistance and reliability on electric insulation under moisture; printed circuit; difunctional epoxy acrylate with biphenyl skeleton with a cyanate ester compound and a polybasic acid anhydride MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2003-02-25 US disclosed
EP-1076262-A1 Photosensitive resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-02-14 EP disclosed
EP-1076262-A1 Photosensitive resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-02-14 EP disclosed