SCHEMBL6680787

SCHEMBL6680787

CC1(CC2(C)CC34OC3(CC2[C]=O)O4)CCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL475699 0.75
SCHEMBL15091912 0.71
SCHEMBL1965964 0.65
SCHEMBL28799674 0.64
Bicarbonate SCHEMBL3257312 0.63
SCHEMBL8401949 0.61 CYP2C19 (0.37)
SCHEMBL2939274 0.60
SCHEMBL8758833 0.58
SCHEMBL3154657 0.57 POLB (0.32)
SCHEMBL17925218 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3647337-B1 CURABLE COMPOSITION, CURABLE PASTE MATERIAL, CURABLE SHEET MATERIAL, CURABLE MODELING MATERIAL, CURING METHOD, AND CURED PRODUCT MITSUBISHI HEAVY IND LTD (JP) 2021-10-27 EP disclosed
EP-3647337-A1 CURABLE COMPOSITION, CURABLE PASTE MATERIAL, CURABLE SHEET MATERIAL, CURABLE MODELING MATERIAL, CURING METHOD, AND CURED PRODUCT Mitsubishi Heavy Industries, Ltd. (JP) 2020-05-06 EP disclosed
EP-1437624-A1 Stereolithographic resins containing selected oxetane compounds 3D SYSTEMS, INC. (US) 2004-07-14 EP disclosed