SCHEMBL6685004

SCHEMBL6685004

O=S(=O)(O)[PbH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL8532128 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL434526 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL418399 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL2555505 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL110268 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL562154 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL113 0.72
Sulfuric Acid SCHEMBL3699224 0.72 CA5A (1.00)
Sulfuric Acid SCHEMBL9751290 0.71 TSHR (0.80)
Sulfuric Acid SCHEMBL23931292 0.67 CA5A (0.86)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-216119570-U X-ray shielding device 合肥海巍光电科技有限公司 2022-03-22 CN claimed
US-6730209-B2 Solder electroplating bath including brighteners having reduced volatility LUCENT TECHNOLOGIES INC. 2004-05-04 US claimed
US-20030159939-A1 Solder electroplating bath including brighteners having reduced volatility LUCENT TECHNOLOGIES 2003-08-28 US claimed
US-6267863-B1 CONTROLLING CURRENT DENSITY AND TEMPERATURE LUCENT TECHNOLOGIES INC. 2001-07-31 US claimed
EP-1029947-A2 Electroplating solution for electroplating lead and lead/tin alloys LUCENT TECHNOLOGIES INC. (US) 2000-08-23 EP claimed
EP-0770708-B1 Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use DAIWA FINE CHEMICALS CO LTD (JP) 2000-01-19 EP claimed
EP-0770708-A1 Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use Daiwa Fine Chemicals Co., Ltd. (JP) 1997-05-02 EP claimed
US-5618404-A APPLYING DIRECT CURRENT VOLTAGE TO AN ANODE MADE OF LEAD OR TIN IN AN ELECTROLYTE SOLUTION CONTAINING AN ORGANIC SULFONIC ACIDS; IONIZATION DAIWA FINE CHEMICALS CO., LTD. (JP) 1997-04-08 US claimed
JP-7054187-A None JP disclosed
JP-8035088-A None JP disclosed
JP-8035088-A None JP disclosed
JP-6306624-A None JP disclosed
JP-6306625-A None JP disclosed
CN-113740320-B Method for analyzing copper impurity content in waste lead-acid storage battery recovery process 北京化工大学 2024-06-25 CN disclosed
US-4589962-A ELECTRODEPOSITION OR TIN OR TIN-LEAD ALLOY ONTO LEADS NATIONAL SEMICONDUCTOR CORPORATION (US) 1986-05-20 US disclosed
US-4137184-A CALCIUM SULFONATE SALT OF POLYISOBUTYLENE OVERBASED WITH CALCIUM CARBONATE CHEVRON RESEARCH COMPANY (US) 1979-01-30 US disclosed
US-4118360-A SULFONATING, HYDROXYALKYLATING WITH AN OXIRANE, ADDING PROCESS OIL TO PLASTICIZE, NEUTRALIZING WITH METAL BASE EXXON RESEARCH & ENGINEERING CO. (US) 1978-10-03 US disclosed
US-4116873-A Lubricating oil composition containing Group I or Group II metal or lead sulfonates CHEVRON RESEARCH COMPANY (US) 1978-09-26 US disclosed
US-3981810-A ESTERS, SILICONES THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 1976-09-21 US disclosed
US-3961123-A SULFONATED NOVOLAKS CONTAINING METAL ATOMS KANEBO, LTD. (JA) 1976-06-01 US disclosed