SCHEMBL669090

SCHEMBL669090

O=S(=O)(O)c1cc(O)c(O)c(O)c1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PGAM1 P18669 1/20 0.48
HSD17B10 Q99714 3/20 0.42
ALDH1A1 P00352 2/20 0.42
CASP1 P29466 1/20 0.42
CASP7 P55210 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
NQO1 P15559 1/20 0.41
MPL P40238 7/20 0.40
CTRC Q99895 2/20 0.38
NSD2 O96028 1/20 0.38
MMP14 P50281 1/20 0.38
CASP6 P55212 1/20 0.38
ING2 Q9H160 1/20 0.37
BCL2 P10415 1/20 0.36
MCL1 Q07820 1/20 0.36
LMNA P02545 1/20 0.36
HPGD P15428 1/20 0.36
HIF1A Q16665 1/20 0.36
NT5E P21589 1/20 0.34
CA1 P00915 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1224928 0.87 PGAM1 (0.53) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL28145555 0.84 PGAM1 (0.52) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL28146678 0.84 PGAM1 (0.52) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL10600623 0.82 HKDC1 (0.38) PGAM1HSD17B10ALDH1A1TDP1MMP14
SCHEMBL1890371 0.81 MPL (0.38) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL7091094 0.81 HSD17B10 (0.40) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL16950300 0.81 PGAM1 (0.42) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL29412224 0.81 HSD17B10 (0.40) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL29373733 0.81 MPL (0.38) PGAM1HSD17B10ALDH1A1CASP1CASP7
SCHEMBL17005598 0.79 HSD17B10 (0.39) PGAM1HSD17B10ALDH1A1CASP1CASP7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10034387-B2 Method for recycling of obsolete printed circuit boards ENTEGRIS, INC. (US) 2018-07-24 US claimed
US-9731368-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ENTEGRIS, INC. (US) 2017-08-15 US claimed
US-9649712-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ENTEGRIS, INC. (US) 2017-05-16 US claimed
US-20170079146-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS ADVANCED TECH MATERIALS (US) 2017-03-16 US claimed
EP-2790845-B1 APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT ENTEGRIS INC (US) 2017-02-08 EP claimed
CN-103402659-B Apparatus and method for stripping solder metal during recycling of discarded electrical and electronic equipment MYKROLIS CORP. (US) 2016-11-30 CN claimed
US-20160122846-A1 SUSTAINABLE PROCESS FOR RECLAIMING PRECIOUS METALS AND BASE METALS FROM E-WASTE ENTEGRIS, INC. 2016-05-05 US claimed
US-20160095230-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS ENTEGRIS, INC. 2016-03-31 US claimed
US-9221114-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-12-29 US claimed
US-9215813-B2 Method for recycling of obsolete printed circuit boards ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-12-15 US claimed
US-20210040581-A1 INTEGRATED ELECTRONIC WASTE RECYCLING AND RECOVERY SYSTEM AND PROCESS OF USING SAME ENTEGRIS INC (US) 2021-02-11 US disclosed
CN-108883443-A Integrated electronic waste recycling and recovery system and use process thereof 恩特格里斯公司 2018-11-23 CN disclosed
US-10034387-B2 Method for recycling of obsolete printed circuit boards ENTEGRIS, INC. (US) 2018-07-24 US disclosed
US-9731368-B2 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment ENTEGRIS, INC. (US) 2017-08-15 US disclosed
CN-106944452-A For the apparatus and method for recycling period stripping solder metal in discarded Electrical and Electronic equipment 恩特格里斯公司 2017-07-14 CN disclosed
EP-2558605-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS Advanced Technology Materials, Inc. (US) 2013-02-20 EP disclosed
WO-2012024603-A2 SUSTAINABLE PROCESS FOR RECLAIMING PRECIOUS METALS AND BASE METALS FROM E-WASTE ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2012-02-23 WO disclosed
WO-2011130622-A1 METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2011-10-20 WO disclosed
US-7247566-B2 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers DUPONT AIR PRODUCTS NANOMATERIALS LLC (US) 2007-07-24 US disclosed
US-20050090109-A1 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers VERSUM MATERIALS US, LLC 2005-04-28 US disclosed