SCHEMBL6694355

SCHEMBL6694355

CCO[Si](CCCOCC1CO1)(OCC)OCC.CO[Si](CCC1CCC2OC2C1)(OC)OC

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.39
ALDH1A1 P00352 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7745321 1.00 SMN1; SMN2 (0.39) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL26185870 0.96 ALDH1A1 (0.41) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL4443155 0.96 SMN1; SMN2 (0.42) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL11041193 0.95 SMN1; SMN2 (0.36) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL3816987 0.94 SMN1; SMN2 (0.37) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL9868126 0.94 SMN1; SMN2 (0.37) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL18919601 0.94 SMN1; SMN2 (0.37) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL16666205 0.93 TSHR (0.41) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL2052975 0.93 TSHR (0.41) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL7636633 0.90 SMN1; SMN2 (0.39) SMN1; SMN2ALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2012091453-A1 PHOTOSENSITIVE RESIN COMPOSITION, OVERCOAT LAYER AND ELECTRONIC DEVICE USING THE SAME ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2012-07-05 WO claimed
CN-117353490-A Rotor of rotary electric machine and method for manufacturing same 三菱电机株式会社 2024-01-05 CN disclosed
US-11220585-B2 Hollow particles and use of same SEKISUI PLASTICS CO., LTD. (JP) 2022-01-11 US disclosed
US-20190100637-A1 HOLLOW PARTICLES AND USE OF SAME SEKISUI PLASTICS CO., LTD. (JP) 2019-04-04 US disclosed
EP-2548903-B1 POLYURETHANE RESIN SUNSTAR ENGINEERING INC (JP) 2017-12-20 EP disclosed
CN-105733439-A Photocurable coating composition, photocurable coating film, and touch panel 奇美实业股份有限公司 2016-07-06 CN disclosed
EP-2736881-A1 PROCESS FOR PRODUCING N-(HETERO)ARYLAZOLES Takasago International Corporation (JP) 2014-06-04 EP disclosed
EP-2697295-A1 ORGANIC RESIN LAMINATE Exatec, LLC. (US) 2014-02-19 EP disclosed
WO-2013032035-A1 PROCESS FOR PRODUCING N-(HETERO)ARYLAZOLES TAKASAGO INTERNATIONAL CORPORATION (JP) 2013-03-07 WO disclosed
WO-2012141708-A1 ORGANIC RESIN LAMINATE EXATEC LLC (US) 2012-10-18 WO disclosed
US-8070045-B1 Curable amine flux composition and method of soldering ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-12-06 US disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed
EP-0863180-B1 Polyamide resin composition and articles formed from them TORAY INDUSTRIES (JP) 2002-08-28 EP disclosed
EP-0863180-A1 Polyamide resin composition and articles formed from them TORAY INDUSTRIES, INC. (JP) 1998-09-09 EP disclosed