SCHEMBL669772

SCHEMBL669772

CC1CC2OC2CC1CC(CCCC(=O)O)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 9/20 0.39
PPM1B O75688 1/20 0.35
ALOX5 P09917 1/20 0.32
CYP1A2 P05177 1/20 0.32
PPP5C P53041 1/20 0.30
DPP4 P27487 1/20 0.30
DPP8 Q6V1X1 1/20 0.30
DPP9 Q86TI2 1/20 0.30
CA2 P00918 1/20 0.30
MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28746184 0.87 CA2 (0.45) ALOX5PPP5CCA2MAPK1
SCHEMBL466168 0.86 SLC18A2 (0.30)
SCHEMBL258784 0.80 GRIK1 (0.38) ALOX5CA2MAPK1
SCHEMBL5049525 0.76 PPM1B (0.41) FOLH1PPM1B
SCHEMBL9578894 0.76 PPM1B (0.41) FOLH1PPM1B
SCHEMBL4897305 0.76 FOLH1 (0.37) FOLH1PPM1BPPP5C
Adipic Acid SCHEMBL28589647 0.75 LMNA (0.46) PPP5C
Ethylene Glycol SCHEMBL29999630 0.73 PPM1B (0.39) FOLH1PPM1B
SCHEMBL5054269 0.72 FOLH1 (0.39) FOLH1PPM1B
SCHEMBL28054539 0.72 PPM1B (0.40) FOLH1PPM1B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0897710-B1 Light-initiated cationic curable compositions and their use 3M ESPE AG (DE) 2004-11-24 EP claimed
EP-0897710-A2 Light-initiated cationic curable compositions and their use ESPE Dental AG (DE) 1999-02-24 EP claimed
WO-2023128581-A1 ADHESIVE COMPOSITION 주식회사동진쎄미켐 2023-07-06 WO disclosed
WO-2023120995-A1 ADHESIVE COMPOSITION HAVING EXCELLENT ADHESION AND ADHESION RELIABILITY, CURED PRODUCT THEREOF, AND DISPLAY DEVICE COMPRISING CURED PRODUCT 주식회사 동진쎄미켐 2023-06-29 WO disclosed
CN-108027558-A LIQUID, HYBRID UV/VIS RADIATION CURABLE RESIN COMPOSITIONS FOR ADDITIVE FABRICATION 帝斯曼知识产权资产管理有限公司 2018-05-11 CN disclosed
CN-104823264-B Imprint method and curable composition for imprint 佳能株式会社 2018-04-17 CN disclosed
CN-107636025-A The liquid manufactured for addition process, the ultraviolet/visible light radiation-curable resin composition mixed 帝斯曼知识产权资产管理有限公司 2018-01-26 CN disclosed
CN-105377971-B Curable composition and process for making epoxy thermoset 罗地亚经营管理公司 2017-12-12 CN disclosed
CN-105807357-B The manufacture method of polarization plates 住友化学株式会社 2017-12-01 CN disclosed
CN-106118566-A There is the adhesive tape of adhesive containing continuous polymer phase 德莎欧洲公司 2016-11-16 CN disclosed
CN-105807357-A Manufacturing method of polarizing plate 住友化学株式会社 2016-07-27 CN disclosed
WO-2001012679-A1 COMPOSITION THAT HARDENS WITH VISIBLE LIGHT AND USE THEREOF DELTAMED MEDIZINPRODUKTE GMBH (DE) 2001-02-22 WO disclosed
CN-1057402-C Semiconductor packaging method TAIWAN GENERAL APPARATUS AND A (CN) 2000-10-11 CN disclosed
EP-0897710-A2 Light-initiated cationic curable compositions and their use ESPE Dental AG (DE) 1999-02-24 EP disclosed
EP-0813571-A1 FLAME RETARDANT FOR STYRENE RESIN AND RESIN COMPOSITION COMPRISING THE SAME Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1997-12-29 EP disclosed
CN-1158497-A Semiconductor packaging method TAIWAN GENERAL APPTS AND APPLI (CN) 1997-09-03 CN disclosed
WO-1996027637-A1 FLAME RETARDANT FOR STYRENE RESIN AND RESIN COMPOSITION COMPRISING THE SAME ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1996-09-12 WO disclosed
CN-1125742-A Coated polycarbonate moulded parts BAYER AG (DE) 1996-07-03 CN disclosed
CN-1005719-B COMPOSITION OF HEAT-RESISTANT POLYMER RESIN 格利-埃塞克斯公司 1989-11-08 CN disclosed
CN-86102731-A Contain 100% solids epoxy, nitrile coating compositions and preparation method thereof 1986-10-15 CN disclosed