Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SIRT2 | Q8IXJ6 | 1/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.34 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.34 |
| ▸ | PRKCA | P17252 | 5/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | CPT1A | P50416 | 1/20 | 0.33 |
| ▸ | PPARG | P37231 | 1/20 | 0.32 |
| ▸ | MMP2 | P08253 | 1/20 | 0.32 |
| ▸ | MMP3 | P08254 | 1/20 | 0.32 |
| ▸ | MMP9 | P14780 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28067536 | 1.00 | SIRT2 (0.40) | SIRT2CYP1A2CYP19A1PTPN1PRKCA | |
| SCHEMBL25260071 | 1.00 | SIRT2 (0.40) | SIRT2CYP1A2CYP19A1PTPN1PRKCA | |
| SCHEMBL6839899 | 1.00 | SIRT2 (0.40) | SIRT2CYP1A2CYP19A1PTPN1PRKCA | |
| SCHEMBL28067504 | 0.98 | SIRT2 (0.39) | SIRT2CYP1A2CYP19A1PTPN1PRKCA | |
| SCHEMBL28198384 | 0.93 | SIRT2 (0.38) | SIRT2CYP1A2CYP19A1PTPN1PRKCA | |
| SCHEMBL28067531 | 0.93 | SIRT2 (0.38) | SIRT2CYP1A2CYP19A1PTPN1PRKCA | |
| SCHEMBL9015189 | 0.92 | CYP1A2 (0.33) | SIRT2CYP1A2CYP19A1 | |
| SCHEMBL9015232 | 0.84 | — | — | |
| SCHEMBL19351114 | 0.81 | ALDH1A1 (0.45) | SIRT2CYP1A2PRKCAALDH1A1TSHR | |
| SCHEMBL14119928 | 0.80 | SIRT2 (0.39) | SIRT2CYP1A2CYP19A1PTPN1PRKCA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040053055-A1 | Rubber toughened epoxy resins for resin infusion processing, methods of using the resins and articles made therefrom | GOODRICH CORPORATION | 2004-03-18 | — | — | US | disclosed |
| EP-0653904-B1 | Via fill compositions for direct attach of devices and methods for applying same | IBM (US) | 2002-12-11 | — | — | EP | disclosed |
| EP-1233663-A2 | Via fill compositions for direct attach of devices and methods for applying same | International Business Machines Corporation (US) | 2002-08-21 | — | — | EP | disclosed |
| US-6197122-B1 | THERMALLY DECOMPOSING ENCAPSULATION AND UNDERFILL TO PROVIDE RESIDUE ON ELECTRONIC COMPONENTS AND DISSOLVING RESIDUE IN POLAR OR BASIC SOLVENT TO EXPOSE ELECTRONIC COMPONENTS | CORNELL RESEARCH FOUNDATION, INC. | 2001-03-06 | — | — | US | disclosed |
| US-6194024-B1 | CONNECTING TWO CIRCUIT CARRIERS; FILLING HOLE WITH SOLDER SPHERE | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-02-27 | — | — | US | disclosed |
| US-6134772-A | Via fill compositions for direct attach of devices and methods of applying same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2000-10-24 | — | — | US | disclosed |
| US-6106891-A | APPLYING A CURABLE FILL TO AN APERTURE, PEELING A LAYER OF POLYMER, APPLYING HEAT AND PRESSURE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2000-08-22 | — | — | US | disclosed |
| US-5973033-A | CURED THERMOSETS FOR ENCAPSULATION AND UNDERFILL FOR ELECTRONIC COMPONENTS THAT ARE THERMALLY DECOMPOSABLE TO ALLOW REPAIR, REPLACEMENT, RECOVERY OR RECYCLING OF OPERATIVE ELECTRONIC COMPONENTS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1999-10-26 | — | — | US | disclosed |
| US-5948922-A | CROSSLINKING THERMOSETTING RESINS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1999-09-07 | — | — | US | disclosed |
| US-5887345-A | Method for applying curable fill compositon to apertures in a substrate | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-03-30 | — | — | US | disclosed |
| EP-0653904-A2 | Via fill compositions for direct attach of devices and methods for applying same | International Business Machines Corporation (US) | 1995-05-17 | — | — | EP | disclosed |
| EP-0209174-B1 | PROCESS FOR PREPARING ADVANCED EPOXY RESIN COMPOSITIONS | SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) | 1992-03-04 | — | — | EP | disclosed |
| US-4933420-A | Epoxy resins containing phosphonium catalysts | THE DOW CHEMICAL COMPANY (US) | 1990-06-12 | — | — | US | disclosed |
| EP-0360195-A2 | Epoxy resins containing phosphonium catalysts | THE DOW CHEMICAL COMPANY (US) | 1990-03-28 | — | — | EP | disclosed |
| EP-0209174-A2 | Process for preparing advanced epoxy resin compositions | SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) | 1987-01-21 | — | — | EP | disclosed |
| US-4634757-A | REACTION OF POLYEPOXIDE WITH PHENOL, ACID OR ANHYDRIDE | SHELL OIL COMPANY (US) | 1987-01-06 | — | — | US | disclosed |
| US-4398013-A | HALOGENONIUM SALT | GENERAL ELECTRIC COMPANY (US) | 1983-08-09 | — | — | US | disclosed |
| US-3977996-A | CHROMIUM (III) CARBOXYLATE, COCATALYST | AEROJET-GENERAL CORPORATION (US) | 1976-08-31 | — | — | US | disclosed |
| US-3978026-A | SYNERGISTIC, CHROMIUMIII TRICARBOXYLATE, COCATALYST | AEROJET-GENERAL CORPORATION (US) | 1976-08-31 | — | — | US | disclosed |
| US-3956241-A | CHROMIUM(III) CHELATE COMPOUND | AEROJET-GENERAL CORPORATION (US) | 1976-05-11 | — | — | US | disclosed |