SCHEMBL6839899

SCHEMBL6839899

CCCCCCCCCCCCC1(CCCCCCCCCCCC)CC(=O)OC1=O

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
SIRT2 Q8IXJ6 1/20 0.40
CYP1A2 P05177 2/20 0.39
CYP19A1 P11511 2/20 0.34
PTPN1 P18031 1/20 0.34
PRKCA P17252 5/20 0.33
ALDH1A1 P00352 1/20 0.33
TSHR P16473 1/20 0.33
CPT1A P50416 1/20 0.33
PPARG P37231 1/20 0.32
MMP2 P08253 1/20 0.32
MMP3 P08254 1/20 0.32
MMP9 P14780 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6704372 1.00 SIRT2 (0.40) SIRT2CYP1A2CYP19A1PTPN1PRKCA
SCHEMBL28067536 1.00 SIRT2 (0.40) SIRT2CYP1A2CYP19A1PTPN1PRKCA
SCHEMBL25260071 1.00 SIRT2 (0.40) SIRT2CYP1A2CYP19A1PTPN1PRKCA
SCHEMBL28067504 0.98 SIRT2 (0.39) SIRT2CYP1A2CYP19A1PTPN1PRKCA
SCHEMBL28198384 0.93 SIRT2 (0.38) SIRT2CYP1A2CYP19A1PTPN1PRKCA
SCHEMBL28067531 0.93 SIRT2 (0.38) SIRT2CYP1A2CYP19A1PTPN1PRKCA
SCHEMBL9015189 0.92 CYP1A2 (0.33) SIRT2CYP1A2CYP19A1
SCHEMBL9015232 0.84
SCHEMBL19351114 0.81 ALDH1A1 (0.45) SIRT2CYP1A2PRKCAALDH1A1TSHR
SCHEMBL14119928 0.80 SIRT2 (0.39) SIRT2CYP1A2CYP19A1PTPN1PRKCA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-10204032-A None JP disclosed
US-6765043-B2 Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof HITACHI, LTD. (JP) 2004-07-20 US disclosed
US-20030232964-A1 Epoxy resin, epoxy resin composition, cured epoxy resin and manufacturing method thereof AKATSUKA MASAKI (JP) 2003-12-18 US disclosed
US-20030229159-A1 Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof HITACHI, LTD. (JP) 2003-12-11 US disclosed
JP-H10204032-A FLUORINE-CONTAINING DIALKYLCARBOXYLIC ACID MONOESTER AND MAGNETIC RECORDING MEDIUM HAVING THE MONOESTER MATSUSHITA ELECTRIC IND CO LTD 1998-08-04 JP disclosed