⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL148090 | 0.69 | — | — | |
| SCHEMBL372265 | 0.69 | — | — | |
| SCHEMBL3297998 | 0.66 | — | — | |
| SCHEMBL11562443 | 0.65 | — | — | |
| SCHEMBL17674971 | 0.65 | — | — | |
| Lithium SCHEMBL3134620 | 0.65 | — | — | |
| SCHEMBL467738 | 0.63 | ALDH1A1 (0.30) | — | |
| SCHEMBL13564232 | 0.63 | — | — | |
| SCHEMBL675715 | 0.63 | — | — | |
| SCHEMBL2990797 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1746132-B1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | ADEKA CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| EP-1801871-B1 | SEMICONDUCTOR DEVICE | KANSAI ELECTRIC POWER CO (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-7939614-B2 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2011-05-10 | — | — | US | disclosed |
| US-7772594-B2 | covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-20080210948-A1 | High-Heat-Resistive Semiconductor Device | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2008-09-04 | — | — | US | disclosed |
| US-20070197755-A1 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1801871-A1 | SEMICONDUCTOR DEVICE | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1746132-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | Adeka Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |
| EP-0632099-B1 | Organopolysiloxane and method for the preparation thereof | DOW CORNING TORAY SILICONE (JP) | 1997-11-12 | — | — | EP | disclosed |
| EP-0639606-B1 | Organopolysiloxane and method for the preparation thereof | DOW CORNING TORAY SILICONE (JP) | 1997-05-21 | — | — | EP | disclosed |
| US-5486588-A | Epoxy-functional organopolysiloxane from SiH polysiloxane, unsaturated epoxy compound and alkene | DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) | 1996-01-23 | — | — | US | disclosed |
| US-5468827-A | Epoxy-functional MQ organopolysiloxanes | DOW CORNING TORAY SILICON CO., LTD. (JP) | 1995-11-21 | — | — | US | disclosed |
| US-5422412-A | Organopolysiloxane and method for the preparation thereof | DOW CORNING TORAY SILICON CO., LTD (JP) | 1995-06-06 | — | — | US | disclosed |
| EP-0639606-A1 | Organopolysiloxane and method for the preparation thereof | Dow Corning Toray Silicone Company, Limited (JP) | 1995-02-22 | — | — | EP | disclosed |
| EP-0632099-A2 | Organopolysiloxane and method for the preparation thereof | Dow Corning Toray Silicone Company, Limited (JP) | 1995-01-04 | — | — | EP | disclosed |