SCHEMBL6741636

SCHEMBL6741636

CCCCCCCCCCCCO[Ti](OCCCCCCCCCCCC)(OCCCCCCCCCCCC)OC(C)C

nearest known ligand 0.36

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 1/20 0.36
LMNA P02545 2/20 0.35
THRB P10828 2/20 0.35
TSHR P16473 1/20 0.35
HTT P42858 2/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
MAPT P10636 1/20 0.34
USP2 O75604 1/20 0.34
SPHK1 Q9NYA1 1/20 0.34
LPAR3 Q9UBY5 4/20 0.33
LPAR2 Q9HBW0 3/20 0.33
LPAR1 Q92633 2/20 0.33
CA1 P00915 2/20 0.33
CA2 P00918 2/20 0.33
CA9 Q16790 2/20 0.33
NAAA Q02083 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8146511 1.00 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL11306849 1.00 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL7548413 0.98 DNM1 (0.33) DNM1LMNATHRBTSHRHTT
SCHEMBL6411822 0.96 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL9781144 0.96 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL9781158 0.96 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL11405161 0.96 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL9781170 0.96 DNM1 (0.36) DNM1LMNATHRBTSHRHTT
SCHEMBL2379584 0.91 ADRB2 (0.35) TSHR
SCHEMBL1361238 0.86 ADRB2 (0.35) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4293063-B1 ECONOMICAL EPOXY RESIN MATERIAL FOR EPOXY ASPHALT WITH LOW TEMPERATURE RESISTANCE AND HIGH FLEXIBILITY AS WELL AS PREPARATION METHOD THEREOF UNIV SOUTHEAST (CN) 2025-05-14 EP claimed
US-12116478-B2 Economical epoxy resin material for epoxy asphalt with low-temperature resistance and high flexibility as well as preparation method thereof SOUTHEAST UNIVERSITY (CN) 2024-10-15 US claimed
CN-118366694-A Heterojunction low-temperature conductive paste with high adhesive force and boiling resistance and preparation method thereof 无锡市儒兴科技开发有限公司 2024-07-19 CN claimed
CN-118185330-A Epoxy asphalt material and preparation method and application thereof 黄卫 2024-06-14 CN claimed
US-20230407083-A1 ECONOMICAL EPOXY RESIN MATERIAL FOR EPOXY ASPHALT WITH LOW-TEMPERATURE RESISTANCE AND HIGH FLEXIBILITY AS WELL AS PREPARATION METHOD THEREOF SOUTHEAST UNIVERSITY (CN) 2023-12-21 US claimed
EP-4293063-A1 ECONOMICAL EPOXY RESIN MATERIAL FOR EPOXY ASPHALT WITH LOW TEMPERATURE RESISTANCE AND HIGH FLEXIBILITY AS WELL AS PREPARATION METHOD THEREOF Southeast University (CN) 2023-12-20 EP claimed
CN-116814042-A Abrasion-resistant repair grouting material for gap of ballastless track filling layer and repair method 中国铁道科学研究院集团有限公司铁道建筑研究所 2023-09-29 CN claimed
CN-114891319-B Economical low-temperature-resistant high-flexibility epoxy resin material for epoxy asphalt and preparation method thereof 东南大学 2023-03-28 CN claimed
CN-114891319-A Economical low-temperature-resistant high-flexibility epoxy resin material for epoxy asphalt and preparation method thereof 东南大学 2022-08-12 CN claimed
US-4302361-A Pressure sensitive conductor JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1981-11-24 US claimed
US-4138369-A CURED SILICONE RUBBER, CONDUCTIVE METAL PARTICLES AND A MONO-, DI- OR TRI-ALKYL TITANATE COMPOUND JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1979-02-06 US claimed
CN-122080365-A Curing agent, composition, cover plate, manufacturing method and application of cover plate 2026-05-26 CN disclosed
CN-122037470-A Epoxy resin composition, preparation method thereof and bolt capacitor cover plate 南通托普电子材料有限公司 2026-05-15 CN disclosed
EP-4293063-B1 ECONOMICAL EPOXY RESIN MATERIAL FOR EPOXY ASPHALT WITH LOW TEMPERATURE RESISTANCE AND HIGH FLEXIBILITY AS WELL AS PREPARATION METHOD THEREOF UNIV SOUTHEAST (CN) 2025-05-14 EP disclosed
US-12116478-B2 Economical epoxy resin material for epoxy asphalt with low-temperature resistance and high flexibility as well as preparation method thereof SOUTHEAST UNIVERSITY (CN) 2024-10-15 US disclosed
CN-108148351-B Radiation protection material 中广核研究院有限公司 2020-06-16 CN disclosed
US-20040077773-A1 Low viscosity, flexible, hydrolytically stable potting compounds LORD CORPORATION 2004-04-22 US disclosed
US-5324767-A Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition HITACHI, LTD. (JP) 1994-06-28 US disclosed
US-4302361-A Pressure sensitive conductor JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1981-11-24 US disclosed
US-4138369-A CURED SILICONE RUBBER, CONDUCTIVE METAL PARTICLES AND A MONO-, DI- OR TRI-ALKYL TITANATE COMPOUND JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1979-02-06 US disclosed