SCHEMBL674407

SCHEMBL674407

Cc1cc(CN2C(=O)c3ccccc3C2=O)c(O)c(-n2nc3ccccc3n2)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 4/20 0.53
RAB9A P51151 4/20 0.53
POLB P06746 2/20 0.51
LMNA P02545 1/20 0.47
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
RXFP1 Q9HBX9 1/20 0.41
ALDH1A1 P00352 3/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
MAPT P10636 2/20 0.40
RECQL P46063 1/20 0.40
KDM4E B2RXH2 3/20 0.40
GAA P10253 1/20 0.38
ALOX15 P16050 1/20 0.38
HTT P42858 1/20 0.38
HSD17B10 Q99714 1/20 0.38
RPS6KA2 Q15349 1/20 0.38
HPGD P15428 2/20 0.38
TGM2 P21980 1/20 0.38
TDP1 Q9NUW8 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30772443 1.00 NPC1 (0.53) NPC1RAB9APOLBLMNAMEN1
SCHEMBL29388780 1.00 NPC1 (0.53) NPC1RAB9APOLBLMNAMEN1
SCHEMBL30061256 0.92 NPC1 (0.52) NPC1RAB9APOLBLMNAMEN1
SCHEMBL426807 0.92 NPC1 (0.52) NPC1RAB9APOLBLMNAMEN1
SCHEMBL31267549 0.88 NPC1 (0.51) NPC1RAB9APOLBLMNAMEN1
SCHEMBL672147 0.88 NPC1 (0.51) NPC1RAB9APOLBLMNAMEN1
SCHEMBL672944 0.86 KMT2A (0.47) NPC1RAB9APOLBMEN1KMT2A
SCHEMBL31267563 0.86 KMT2A (0.47) NPC1RAB9APOLBMEN1KMT2A
SCHEMBL29353331 0.86 NPC1 (0.49) NPC1RAB9APOLBLMNAALDH1A1
SCHEMBL272931 0.86 NPC1 (0.49) NPC1RAB9APOLBLMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024038853-A1 RESIN COMPOSITION, PELLETS, AND MOLDED ARTICLE 三菱ケミカル株式会社 2024-02-22 WO disclosed
WO-2023214487-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION 三菱ケミカル株式会社 2023-11-09 WO disclosed
US-7968632-B2 Polycarbonate resin composition and process for producing thereof MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-06-28 US disclosed
EP-1892266-B1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLES MITSUBISHI ENG PLASTICS CORP (JP) 2010-07-21 EP disclosed
US-20090186967-A1 Polycarbonate resin composition and process for producing thereof MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 2009-07-23 US disclosed
EP-1892266-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLES Mitsubishi Engineering-Plastics Corporation (JP) 2008-02-27 EP disclosed
US-6762250-B2 TRANSPARENCY, FLUIDITY; CONTAINING POLYSILOXANE HAVING AT LEAST AROMATIC HYDROCARBON FUNCTIONALITY, CARBOXYLIC ACID ESTER AND/OR ETHER LINKAGES AND PHOSPHORIC ESTER GROUP ATTACHMENT MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2004-07-13 US disclosed
US-6727294-B2 RADIATION TRANSPARENT MOLDING MATERIALS MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2004-04-27 US disclosed
US-20040054116-A1 Polycarbonate resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION 2004-03-18 US disclosed
US-20010034419-A1 Radiation transparent molding materials MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2001-10-25 US disclosed
US-5360692-A Positive type 1,2-naphthoquinonediazide photoresist composition containing benzotriazole light absorbing agent FUJI PHOTO FILM CO., LTD. (JP) 1994-11-01 US disclosed