SCHEMBL6753967

SCHEMBL6753967

c1ccc(CCCCc2nc3ccccc3[nH]2)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.83
NPC1 O15118 2/20 0.81
RAB9A P51151 2/20 0.81
GAA P10253 2/20 0.67
CHRM1 P11229 1/20 0.59
SMN1; SMN2 Q16637 1/20 0.59
AR P10275 1/20 0.59
PDE10A Q9Y233 1/20 0.58
DAGLA Q9Y4D2 1/20 0.57
MAPT P10636 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5274918 0.98 POLB (0.80) POLBNPC1RAB9AGAACHRM1
SCHEMBL8974269 0.98 POLB (0.80) POLBNPC1RAB9AGAACHRM1
SCHEMBL30583064 0.98 POLB (0.80) POLBNPC1RAB9AGAACHRM1
SCHEMBL8958097 0.98 POLB (0.80) POLBNPC1RAB9AGAACHRM1
SCHEMBL8974511 0.98 POLB (0.80) POLBNPC1RAB9AGAACHRM1
SCHEMBL6367344 0.98 POLB (0.80) POLBNPC1RAB9AGAACHRM1
SCHEMBL6753946 0.97 NPC1 (0.81) POLBNPC1RAB9AGAACHRM1
SCHEMBL7006523 0.91 POLB (1.00) POLBNPC1RAB9AGAACHRM1
SCHEMBL784574 0.89 RAB9A (1.00) POLBNPC1RAB9AGAACHRM1
SCHEMBL30583066 0.89 RAB9A (1.00) POLBNPC1RAB9AGAACHRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
EP-0551112-B1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same MEC CO LTD (JP) 1996-04-03 EP disclosed
US-5476947-A Excellent rust preventing effect, useful as corrosion resistance protective coating in printed wiring boards MEC CO., LTD. (JP) 1995-12-19 US disclosed
US-5435860-A Corrosion resistance for printed circuits MEC CO., LTD. (JP) 1995-07-25 US disclosed
EP-0551112-A1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same MEC CO., Ltd. (JP) 1993-07-14 EP disclosed