SCHEMBL784574

SCHEMBL784574

c1ccc(CCc2nc3ccccc3[nH]2)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 4/20 1.00
NPC1 O15118 3/20 1.00
GAA P10253 2/20 0.71
POLB P06746 1/20 0.70
MAPT P10636 2/20 0.68
SMN1; SMN2 Q16637 3/20 0.67
ALDH1A1 P00352 1/20 0.67
PDE10A Q9Y233 2/20 0.66
CHRM1 P11229 1/20 0.63
HTT P42858 1/20 0.61
DDAH1 O94760 1/20 0.59
AR P10275 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30583066 1.00 RAB9A (1.00) RAB9ANPC1GAAPOLBMAPT
SCHEMBL230157 0.90 POLB (0.84) RAB9ANPC1GAAPOLBMAPT
SCHEMBL6753967 0.89 POLB (0.83) RAB9ANPC1GAAPOLBMAPT
SCHEMBL6753946 0.89 NPC1 (0.81) RAB9ANPC1GAAPOLBMAPT
SCHEMBL9015206 0.89 RAB9A (0.79) RAB9ANPC1GAAPOLBMAPT
SCHEMBL30583064 0.88 POLB (0.80) RAB9ANPC1GAAPOLBMAPT
SCHEMBL8974511 0.88 POLB (0.80) RAB9ANPC1GAAPOLBMAPT
SCHEMBL5274918 0.88 POLB (0.80) RAB9ANPC1GAAPOLBMAPT
SCHEMBL8974269 0.88 POLB (0.80) RAB9ANPC1GAAPOLBMAPT
SCHEMBL6367344 0.88 POLB (0.80) RAB9ANPC1GAAPOLBMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2080822-B1 DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION UEMURA KOGYO KK (JP) 2017-03-29 EP claimed
US-8992756-B2 Direct plating method and solution for palladium conductor layer formation C. UYEMURA & CO., LTD. (JP) 2015-03-31 US claimed
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
CN-116810216-A Water-soluble pre-flux and surface treatment method 株式会社田村制作所 2023-09-29 CN disclosed
CN-116791110-A Method for electrocatalytic synthesis of benzimidazoloisoquinoline analogue 长沙理工大学 2023-09-22 CN disclosed
CN-109468659-A The method of room temperature synthesizing benzimidazole under the conditions of electrocatalytic method water phase 云南师范大学 2019-03-15 CN disclosed
CN-109456273-A The method of benzenecarboximidamide class compound synthesis benzimidazole compound is used in microwave method water phase 云南师范大学 2019-03-12 CN disclosed
EP-2080822-B1 DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION UEMURA KOGYO KK (JP) 2017-03-29 EP disclosed
US-9540332-B2 Benzimidazole derivatives as selective blockers of persistent sodium current ALLERGAN, INC. (US) 2017-01-10 US disclosed
US-20020016073-A1 Methods of polishing, interconnect-fabrication, and producing semiconductor devices HITACHI, LTD. 2002-02-07 US disclosed
CN-1287025-A Coating method for resin type protection composition, glue spreader using the same method and the same composition MICO CO LTD (JP) 2001-03-14 CN disclosed
EP-0791671-B1 Surface treating agent for copper or copper alloy SHIKOKU CHEM (JP) 1999-06-16 EP disclosed
US-5795409-A MIXTURE OF A (BENZ)IMIDAZOLE COMPOUND, CHELATE COMPOUND AND IRON SHIKOKU CHEMICALS CORPORATION (JP) 1998-08-18 US disclosed
EP-0791671-A1 Surface treating agent for copper or copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1997-08-27 EP disclosed
EP-0551112-B1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same MEC CO LTD (JP) 1996-04-03 EP disclosed
US-5476947-A Excellent rust preventing effect, useful as corrosion resistance protective coating in printed wiring boards MEC CO., LTD. (JP) 1995-12-19 US disclosed
US-5435860-A Corrosion resistance for printed circuits MEC CO., LTD. (JP) 1995-07-25 US disclosed
EP-0551112-A1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same MEC CO., Ltd. (JP) 1993-07-14 EP disclosed