SCHEMBL6756137

SCHEMBL6756137

CCCCc1nc2c(C)c(C)ccc2[nH]1

nearest known ligand 0.54

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
▸ CBFB Q13951 1/20 0.42
▸ KMT2A Q03164 1/20 0.41
▸ OPRM1 P35372 1/20 0.40
▸ PARP1 P09874 1/20 0.40
▸ ALDH1A1 P00352 1/20 0.38
▸ MAPK1 P28482 1/20 0.38
▸ GSK3B P49841 1/20 0.38
▸ POLB P06746 1/20 0.38
▸ MAPT P10636 1/20 0.37
▸ HTT P42858 1/20 0.37
▸ ADAMTS5 Q9UNA0 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6756143 0.95 CBFB (0.41) CBFBKMT2AOPRM1POLB
SCHEMBL6756142 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6755314 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6753879 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6753963 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6756288 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6753984 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6755288 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6753954 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB
SCHEMBL6753932 0.94 GPR84 (0.42) CBFBKMT2AOPRM1ALDH1A1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 — — US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 — — US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP disclosed
EP-0400835-A1 Substituted benzimidazoles as angiotensin II antagonists MERCK & CO. INC. (US) 1990-12-05 — — EP disclosed
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