SCHEMBL6762995

SCHEMBL6762995

CC1CCCC(=C2CC3CCC2C3)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6759293 0.81
SCHEMBL26601175 0.79
SCHEMBL11407381 0.75
SCHEMBL27731172 0.71 SLC6A3 (0.31)
SCHEMBL581366 0.66 HSD17B10 (0.37)
SCHEMBL2158960 0.65 NOS3 (0.33)
SCHEMBL3139956 0.62
SCHEMBL1402674 0.62
SCHEMBL1684701 0.62 CYP2A6 (0.34)
SCHEMBL4311225 0.61 CYP2A6 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12215229-B2 Lip seal EAGLE INDUSTRY CO., LTD. (JP) 2025-02-04 US disclosed
US-20220275176-A1 LIP SEAL EAGLE INDUSTRY CO., LTD. (JP) 2022-09-01 US disclosed
EP-4050242-A1 LIP SEAL Eagle Industry Co., Ltd. (JP) 2022-08-31 EP disclosed
CN-114407458-A Composite molded body based on EPDM (ethylene-propylene-diene monomer) foaming material and preparation method thereof 易宝(福建)高分子材料股份公司 2022-04-29 CN disclosed
EP-2805995-B1 FIBER REINFORCED POLYPROPYLENE RESIN COMPOSITION, MOLDING MATERIAL AND PREPREG TORAY INDUSTRIES (JP) 2018-06-27 EP disclosed
US-9879123-B2 Fiber-reinforced polypropylene resin composition, molding material and prepreg TORAY INDUSTRIES, INC. (JP) 2018-01-30 US disclosed
US-20140356612-A1 FIBER-REINFORCED POLYPROPYLENE RESIN COMPOSITION, MOLDING MATERIAL AND PREPREG TORAY INDUSTRIES, INC. (JP) 2014-12-04 US disclosed
EP-2805995-A1 FIBER REINFORCED POLYPROPYLENE RESIN COMPOSITION, MOLDING MATERIAL AND PREPREG Toray Industries, Inc. (JP) 2014-11-26 EP disclosed
US-6790568-B2 IN WHICH AN ALKALI-SOLUBLE THERMOPLASTIC RESIN LAYER AND A TEMPORARY SUPPORT CAN BE COMPLETELY SEPARATED WITHOUT A PART OF THE ALKALI-SOLUBLE THERMOPLASTIC RESIN LAYER REMAINING ON THE TEMPORARY SUPPORT FUJI PHOTO FILM CO., LTD. (JP) 2004-09-14 US disclosed
US-20030143473-A1 Photosensitive transfer material and color filter FUJI PHOTO FILM CO., LTD. 2003-07-31 US disclosed
EP-0292251-B1 Aromatic polyester composition and process for producing the same TORAY INDUSTRIES (JP) 1993-11-24 EP disclosed
US-4879328-A MOLDING MATERIALS TORAY INDUSTRIES (JP) 1989-11-07 US disclosed
EP-0292251-A2 Aromatic polyester composition and process for producing the same TORAY INDUSTRIES, INC. (JP) 1988-11-23 EP disclosed